LTC2855HDE

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Mfr.Part #
LTC2855HDE
Manufacturer
Analog Devices, Inc.
Package / Case
12-WFDFN Exposed Pad
Datasheet
Download
Description
IC TRANSCEIVER FULL 1/1 12DFN
Stock
722
In Stock :
722

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Manufacturer :
Analog Devices, Inc.
Product Category :
Drivers, Receivers, Transceivers
Voltage - Supply :
3V~3.6V
RoHS Status :
ROHS3 Compliant
Terminal Pitch :
0.5mm
Transmit Delay-Max :
50 ns
Time@Peak Reflow Temperature-Max (s) :
30
Pin Count :
12
ECCN Code :
EAR99
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Height Seated (Max) :
0.8mm
Data Rate :
20Mbps
Power Supplies :
3.3V
Number of Terminations :
12
JESD-30 Code :
R-PDSO-N12
Base Part Number :
LTC2855
Out Swing-Min :
1.5 V
Published :
2008
Number of Drivers/Receivers :
1/1
Receiver Number of Bits :
1
Number of Functions :
1
Qualification Status :
Not Qualified
Receiver Hysteresis :
25mV
Factory Lead Time :
8 Weeks
Operating Temperature :
-40°C~125°C
HTS Code :
8542.39.00.01
Width :
3mm
Duplex :
Full
Length :
4mm
Terminal Form :
NO LEAD
Supply Voltage :
3.3V
Terminal Finish :
Matte Tin (Sn)
Packaging :
Tube
Protocol :
RS422, RS485
Terminal Position :
Dual
Driver Number of Bits :
1
Type :
Transceiver
Package / Case :
12-WFDFN Exposed Pad
Input Characteristics :
DIFFERENTIAL SCHMITT TRIGGER
Peak Reflow Temperature (Cel) :
260
Differential Output :
yes
Receive Delay-Max :
70 ns
Interface Standard :
EIA-485-A; TIA-485-A
Mounting Type :
Surface Mount
Surface Mount :
yes
JESD-609 Code :
e3
Datasheets
LTC2855HDE
Introducing Drivers, Receivers, Transceivers Analog Devices, Inc. LTC2855HDE from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:12, Base Part Number:LTC2855, Operating Temperature:-40°C~125°C, Type:Transceiver, Package / Case:12-WFDFN Exposed Pad, Mounting Type:Surface Mount, LTC2855HDE pinout, LTC2855HDE datasheet PDF, LTC2855HDE amp .Beyond Drivers, Receivers, Transceivers Analog Devices, Inc. LTC2855HDE ,we also offer SP3232EBCN-L/TR, MAX202IDR, THVD1400DR, Our vast inventory has you covered. Contact us now for immediate solutions.

Analog Devices, Inc. LTC2855HDE


Drivers, Receivers, Transceivers Analog Devices, Inc. LTC2855HDE Overview

The LTC2855HDE from Analog Devices, Inc. is a highly robust and versatile transceiver component, specifically designed for applications requiring high reliability and enhanced data transmission capabilities. This device offers full duplex communication in a compact 12-lead DFN package, making it ideal for space-constrained applications. As part of the Drivers, Receivers, Transceivers category, the LTC2855HDE leverages advanced technology to provide efficient solutions for a variety of communication challenges, ensuring robust signal integrity and minimizing noise. With the keyword Drivers, Receivers, Transceivers Analog Devices, Inc. LTC2855HDE, this product stands out in the market for its precision engineering and suitability for demanding environments.

LTC2855HDE Features

The LTC2855HDE transceiver includes several key features that make it a top choice for professionals in the electronic components industry. These features include full duplex communication capability, which allows for simultaneous sending and receiving of data. The device operates over a wide temperature range, making it suitable for industrial applications requiring durability under extreme conditions. Additionally, its low power consumption ensures efficiency and cost-effectiveness in continuous operation scenarios.

LTC2855HDE Applications

  • Industrial Automation: Used in communication systems within automated production lines to facilitate reliable data exchange between machinery and control units.
  • Automotive Systems: Employs robust signal integrity ideal for automotive communication networks, enhancing vehicle safety and performance monitoring.
  • Telecommunication Equipment: Integral for the design of telecom infrastructure, ensuring high-speed data transmission and reliability in network operations.
  • Consumer Electronics: Applied in devices such as smartphones and tablets for enhanced communication capabilities within compact device frameworks.
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