LPC5502JBD64E

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Instruction Set Architecture :

RISC

Package / Case :

64-TQFP Exposed Pad

SPI :

7

Series :

LPC550x

Package Height :

1.05(Max)

Package Length :

10

Core Architecture :

ARM

Package :

Tray

USB :

0

Voltage - Supply (Vcc/Vdd) :

1.8V ~ 3.6V

Peripherals :

Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT

Number of I/Os :

45 I/O

EEPROM Size :

-

Device Core :

ARM Cortex M33

I2S :

8

Operating Temperature :

-40°C ~ 105°C (TA)

Interfaces :

CAN, I2C, I2S, SPI, UART, USART

Programmability :

yes

Oscillator Type :

Internal

Supplier Package :

HTQFP EP

ECCN (US) :

3A991.A.2

ADC Resolution (bit) :

16

Maximum Clock Rate (MHz) :

96

Minimum Operating Supply Voltage (V) :

1.8

Program Memory Size :

64KB

RAM Size :

48kB

Data Bus Width :

32bit

Interface Type :

CAN/I2C/I2S/SPI/USART

UART :

0

No. of Timers :

5

Number of I/O :

45

Data Converters :

A/D 9x16b SAR

Maximum Operating Temperature :

+ 105 C

Product Status :

Active

Data Bus Width (bit) :

32

Connectivity :

CANbus, Flex COMM, I²C, SPI, UART/USART

Pin Count :

64

Base Product Number :

LPC5502

Package Width :

10

Maximum Operating Supply Voltage (V) :

3.6

Minimum Operating Temperature :

- 40 C

Program Memory Type :

Flash

Typical Operating Supply Voltage (V) :

3.3

Maximum CPU Frequency (MHz) :

96

Ethernet :

0

Mounting Style :

SMD/SMT

I2C :

8

Maximum Operating Temperature (°C) :

105

PCB changed :

64

RoHS Status :

RoHS Compliant

Core Size :

32-Bit Single-Core

USART :

8

Minimum Operating Temperature (°C) :

-40

Number of ADCs :

Single

Packaging :

Tray

Supplier Device Package :

64-HTQFP (10x10)

Mounting :

Surface Mount

MSL :

MSL 3 - 168 hours

Speed :

96MHz

Mounting Type :

Surface Mount

Core Processor :

ARM® Cortex®-M33