LPC4310FET100

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Mfr.Part #
LPC4310FET100
Manufacturer
NXP Semiconductors
Package / Case
100-TFBGA
Datasheet
Download
Description
IC MCU 32BIT ROMLESS 100TFBGA
Stock
27,801
In Stock :
27,801

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Manufacturer :
NXP Semiconductors
Product Category :
Microcontrollers
Package :
Bulk
Lead Shape :
Ball
Program Memory Type :
ROMless
Minimum Operating Supply Voltage (V) :
2.2
Core Processor :
ARM® Cortex®-M4/M0
Product Status :
Active
Supplier Device Package :
100-TFBGA (9x9)
Core Architecture :
ARM
Maximum Power Dissipation (mW) :
1500
Minimum Operating Temperature (°C) :
-40
Voltage - Supply (Vcc/Vdd) :
2.2V ~ 3.6V
Program Memory Size :
-
Ethernet :
0
PCB changed :
100
PWM :
1
Pin Count :
100
Instruction Set Architecture :
RISC
Mounting :
Surface Mount
Peripherals :
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
DAC Channels :
1
EEPROM Size :
-
Number of I/O :
49
Standard Package Name :
BGA
UART :
1
No. of Timers :
6
Maximum Operating Temperature (°C) :
85
Maximum Clock Rate (MHz) :
180
Maximum CPU Frequency (MHz) :
180
Interface Type :
CAN/I2C/I2S/SPI/UART/USART
Special Feature :
CAN Controller
Mounting Type :
Surface Mount
Oscillator Type :
Internal
Family Name :
LPC4300
Speed :
204MHz
ADC Resolution (bit) :
10/10
Package Width :
9.1(Max)
Base Product Number :
LPC4310
Device Core :
ARM Cortex M4/M0
Series :
LPC43xx
I2C :
2
SPI :
4
Package Length :
9.1(Max)
Number of ADCs :
Dual
Programmability :
No
Data Bus Width (bit) :
32
Typical Operating Supply Voltage (V) :
3.3|2.5
I2S :
2
USB :
0
Connectivity :
CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
DAC Resolution (bit) :
10
Operating Temperature :
-40°C ~ 85°C (TA)
Data Converters :
A/D 4x10b; D/A 1x10b
RAM Size :
168KB
Package / Case :
100-TFBGA
Number of DACs :
Single
ECCN (US) :
EAR99
HTS :
8542.31.00.01
Maximum Operating Supply Voltage (V) :
3.6
RoHS Status :
RoHS Compliant
Package Height :
0.8(Max)
Supplier Package :
TFBGA
Watchdog :
1
CECC Qualified :
No
Core Size :
32-Bit Dual-Core
USART :
3
Datasheets
LPC4310FET100
Introducing Microcontrollers NXP Semiconductors LPC4310FET100 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:-40°C ~ 85°C (TA), Package / Case:100-TFBGA, LPC4310FET100 pinout, LPC4310FET100 datasheet PDF, LPC4310FET100 amp .Beyond Microcontrollers NXP Semiconductors LPC4310FET100 ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors LPC4310FET100


Microcontrollers NXP Semiconductors LPC4310FET100 Overview

The Microcontrollers NXP Semiconductors LPC4310FET100 is a powerful, highly versatile 32-bit microcontroller that caters to a broad range of applications, especially where efficiency, reliability, and high-speed processing are required. This ROM-less MCU from NXP Semiconductors offers a flexible platform for design engineers, integrating advanced peripherals and support for multiple high-speed communication protocols. With its lack of on-chip ROM, the LPC4310FET100 allows designers to customize memory configurations, addressing specific needs and optimizing system performance.

LPC4310FET100 Features

The LPC4310FET100 boasts significant features that make it suitable for sophisticated applications. Key features include its dual-core configuration, consisting of an ARM Cortex-M4F and a Cortex-M0 processor. This unique setup enables efficient division of tasks and enhances performance through parallel processing. Additional features include high-speed USB 2.0 interface, a versatile DMA system, and extensive I/O options. Its 100TFBGA package ensures a compact footprint while providing sufficient I/O capabilities for even the most demanding tasks.

LPC4310FET100 Applications

  • Industrial Automation: Utilized in managing complex automation systems, the LPC4310FET100's robust processing power and multiple I/O interfaces can handle multiple sensor inputs and actuator controls seamlessly.
  • Medical Devices: Ideal for wearable health monitors and advanced diagnostic systems, where its capability for high data rate processing ensures rapid analysis and reliable performance.
  • Communication Systems: Used in communication equipment such as routers and switches, the high-speed interfaces and dual-core architecture facilitate efficient data handling and throughput.
  • Consumer Electronics: Powers advanced consumer electronics, including gaming consoles and smart home devices, offering rich multimedia experiences and responsive user interfaces.
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