LPC2925FBD100,551

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Operating Temperature :

-40°C~85°C TA

Base Part Number :

LPC292*

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Peripherals :

DMA, POR, PWM, WDT

Number of I/O :

60

Series :

LPC2900

ROM (words) :

524288

DMA Channels :

yes

Width :

14mm

PWM Channels :

yes

Has ADC :

yes

RAM Size :

40K x 8

Pin Count :

100

Connectivity :

CANbus, I2C, LINbus, SPI, UART/USART, USB

Mounting Type :

Surface Mount

Qualification Status :

Not Qualified

Number of Terminations :

100

Terminal Finish :

Tin (Sn)

RoHS Status :

ROHS3 Compliant

Clock Frequency :

125MHz

Package / Case :

100-LQFP

Source Url Status Check Date :

2013-06-14 00:00:00

Height Seated (Max) :

1.6mm

DAC Channels :

No

Speed :

125MHz

Surface Mount :

yes

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Oscillator Type :

Internal

Power Supplies :

1.83/3.3V

Supply Voltage-Max (Vsup) :

1.89V

Core Processor :

ARM9®

Program Memory Size :

512KB 512K x 8

Supply Voltage-Min (Vsup) :

1.71V

Bit Size :

32

Terminal Form :

Gull wing

Factory Lead Time :

12 Weeks

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Packaging :

Tray

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

JESD-609 Code :

e3

Length :

14mm

Supply Voltage :

1.8V

Terminal Pitch :

0.5mm

JESD-30 Code :

S-PQFP-G100

Core Size :

16/32-Bit

EEPROM Size :

16K x 8

Program Memory Type :

Flash

Terminal Position :

QUAD

Data Converter :

A/D 16x8b

Voltage - Supply (Vcc/Vdd) :

1.71V~3.6V

Published :

2010