LPC2925FBD100,551

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Height Seated (Max) :

1.6mm

Supply Voltage :

1.8V

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Width :

14mm

Source Url Status Check Date :

2013-06-14 00:00:00

Core Processor :

ARM9®

Qualification Status :

Not Qualified

Supply Voltage-Min (Vsup) :

1.71V

Base Part Number :

LPC292*

RoHS Status :

ROHS3 Compliant

Terminal Form :

Gull wing

Terminal Finish :

Tin (Sn)

EEPROM Size :

16K x 8

Oscillator Type :

Internal

Published :

2010

Voltage - Supply (Vcc/Vdd) :

1.71V~3.6V

PWM Channels :

yes

Bit Size :

32

Connectivity :

CANbus, I2C, LINbus, SPI, UART/USART, USB

Package / Case :

100-LQFP

Packaging :

Tray

Length :

14mm

Program Memory Type :

Flash

Number of I/O :

60

RAM Size :

40K x 8

Series :

LPC2900

Has ADC :

yes

ROM (words) :

524288

Program Memory Size :

512KB 512K x 8

Surface Mount :

yes

Mounting Type :

Surface Mount

Terminal Pitch :

0.5mm

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Terminal Position :

QUAD

Supply Voltage-Max (Vsup) :

1.89V

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Speed :

125MHz

Data Converter :

A/D 16x8b

Pin Count :

100

Power Supplies :

1.83/3.3V

JESD-609 Code :

e3

Peripherals :

DMA, POR, PWM, WDT

JESD-30 Code :

S-PQFP-G100

Number of Terminations :

100

Factory Lead Time :

12 Weeks

Clock Frequency :

125MHz

Core Size :

16/32-Bit

Operating Temperature :

-40°C~85°C TA

DMA Channels :

yes

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

DAC Channels :

No