LPC2460FBD208,551

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Terminal Form :

Gull wing

Terminal Position :

QUAD

Package / Case :

208-LQFP

Terminal Pitch :

0.5mm

Core Processor :

ARM7®

Moisture Sensitivity Level (MSL) :

2 (1 Year)

ECCN Code :

EAR99

Terminal Finish :

Tin (Sn)

Peak Reflow Temperature (Cel) :

260

Core Size :

16/32-Bit

Voltage - Supply (Vcc/Vdd) :

3V~3.6V

DAC Channels :

yes

Supply Voltage-Max (Vsup) :

3.6V

Width :

28mm

Bit Size :

32

RoHS Status :

ROHS3 Compliant

Packaging :

Tray

Supply Voltage-Min (Vsup) :

3V

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

ROM (words) :

0

Height Seated (Max) :

1.6mm

Supply Voltage :

3.3V

Clock Frequency :

24MHz

ROM Programmability :

MROM

HTS Code :

8542.31.00.01

Qualification Status :

Not Qualified

PWM Channels :

yes

JESD-30 Code :

S-PQFP-G208

Surface Mount :

yes

Published :

2003

External Data Bus Width :

32

Has ADC :

yes

Power Supplies :

3.3V

Pin Count :

208

JESD-609 Code :

e3

Series :

LPC2400

Oscillator Type :

Internal

Data Converter :

A/D 8x10b; D/A 1x10b

Operating Temperature :

-40°C~85°C TA

DMA Channels :

yes

Number of Terminations :

208

Program Memory Type :

ROMless

Number of I/O :

160

Connectivity :

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

Mounting Type :

Surface Mount

Speed :

72MHz

Address Bus Width :

24

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Peripherals :

Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT

Length :

28mm

Factory Lead Time :

12 Weeks

RAM Size :

96K x 8

Base Part Number :

LPC24*0