LPC2364HBD100,551

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

HTS Code :

8542.31.00.01

Peripherals :

Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT

Supply Voltage :

3.3V

Packaging :

Tray

RoHS Status :

ROHS3 Compliant

Voltage - Supply (Vcc/Vdd) :

3V~3.6V

Length :

14mm

Oscillator Type :

Internal

Factory Lead Time :

12 Weeks

Speed :

72MHz

Connectivity :

I²C, IrDA, LINbus, SPI, UART/USART

Base Part Number :

LPC2364

Program Memory Size :

128KB 128K x 8

Surface Mount :

yes

JESD-609 Code :

e3

Package / Case :

100-LQFP

Qualification Status :

Not Qualified

Mounting Type :

Surface Mount

Pin Count :

100

Terminal Form :

Gull wing

Number of I/O :

70

Program Memory Type :

Flash

Number of Terminations :

100

JESD-30 Code :

S-PQFP-G100

Width :

14mm

Has ADC :

yes

RAM Size :

34K x 8

Published :

2003

ROM (words) :

131072

ECCN Code :

EAR99

Clock Frequency :

25MHz

Bit Size :

32

PWM Channels :

yes

Power Supplies :

3.3V

Peak Reflow Temperature (Cel) :

260

Core Size :

16/32-Bit

Supply Voltage-Min (Vsup) :

3V

Core Processor :

ARM7®

Series :

LPC2300

Supply Voltage-Max (Vsup) :

3.6V

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Terminal Finish :

Tin (Sn)

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Terminal Pitch :

0.5mm

DMA Channels :

yes

Terminal Position :

QUAD

Data Converter :

A/D 6x10b; D/A 1x10b

Operating Temperature :

-40°C~125°C TA