LPC2364FET100,518

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Series :

LPC2300

RoHS Status :

ROHS3 Compliant

Supply Voltage-Max (Vsup) :

3.6V

Packaging :

Tape and Reel (TR)

JESD-609 Code :

e1

Terminal Form :

Ball

ECCN Code :

EAR99

Number of I/O :

70

Power Supplies :

3.3V

Mounting Type :

Surface Mount

Data Converter :

A/D 6x10b; D/A 1x10b

Time@Peak Reflow Temperature-Max (s) :

40

HTS Code :

8542.31.00.01

Terminal Position :

BOTTOM

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Pitch :

0.8mm

Oscillator Type :

Internal

Package / Case :

100-TFBGA

Core Size :

16/32-Bit

Bit Size :

32

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Peak Reflow Temperature (Cel) :

260

Number of Terminations :

100

Speed :

72MHz

Pin Count :

100

ROM (words) :

131072

Factory Lead Time :

12 Weeks

Connectivity :

I²C, IrDA, LINbus, SPI, UART/USART

External Data Bus Width :

16

Length :

9mm

PWM Channels :

yes

Has ADC :

yes

Voltage - Supply (Vcc/Vdd) :

3V~3.6V

Core Processor :

ARM7®

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

RAM Size :

34K x 8

Height Seated (Max) :

1.2mm

Supply Voltage-Min (Vsup) :

3V

Base Part Number :

LPC2364

Operating Temperature :

-40°C~85°C TA

Surface Mount :

yes

JESD-30 Code :

S-PBGA-B100

Clock Frequency :

25MHz

Qualification Status :

Not Qualified

Peripherals :

Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT

Published :

2003

DMA Channels :

yes

Program Memory Size :

128KB 128K x 8

Program Memory Type :

Flash

Supply Voltage :

3.3V

DAC Channels :

yes

Width :

9mm