LPC2292FBD144,551

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Mfr.Part #
LPC2292FBD144,551
Manufacturer
NXP Semiconductors
Package / Case
144-LQFP
Datasheet
Download
Description
IC MCU 16/32B 256KB FLSH 144LQFP
Stock
41,613
In Stock :
41,613

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Manufacturer :
NXP Semiconductors
Product Category :
Microcontrollers
Number of Terminations :
144
Qualification Status :
Not Qualified
Width :
20mm
DMA Channels :
No
JESD-609 Code :
e3
Clock Frequency :
50MHz
Core Processor :
ARM7®
Published :
2003
Address Bus Width :
24
Program Memory Size :
256KB 256K x 8
Operating Temperature :
-40°C~85°C TA
Supply Voltage-Max (Vsup) :
1.95V
Height Seated (Max) :
1.6mm
Supply Voltage-Min (Vsup) :
1.65V
Moisture Sensitivity Level (MSL) :
2 (1 Year)
Supply Voltage :
1.8V
Pin Count :
144
Package / Case :
144-LQFP
Surface Mount :
yes
RoHS Status :
ROHS3 Compliant
Terminal Finish :
MATTE TIN
Voltage - Supply (Vcc/Vdd) :
1.65V~3.6V
JESD-30 Code :
S-PQFP-G144
Data Converter :
A/D 8x10b
Length :
20mm
Connectivity :
CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Terminal Position :
QUAD
Core Size :
16/32-Bit
Program Memory Type :
Flash
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Bit Size :
32
ECCN Code :
3A001.A.3
Number of I/O :
112
Packaging :
Tray
DAC Channels :
No
RAM Size :
16K x 8
Terminal Pitch :
0.5mm
PWM Channels :
yes
Base Part Number :
LPC2292
Oscillator Type :
Internal
HTS Code :
8542.31.00.01
Peripherals :
POR, PWM, WDT
Additional Feature :
ALSO REQUIRES 3.3V SUPPLY
Mounting Type :
Surface Mount
Terminal Form :
Gull wing
Has ADC :
yes
Series :
LPC2200
Speed :
60MHz
External Data Bus Width :
32
Datasheets
LPC2292FBD144,551
Introducing Microcontrollers NXP Semiconductors LPC2292FBD144,551 from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:144, Operating Temperature:-40°C~85°C TA, Package / Case:144-LQFP, Base Part Number:LPC2292, Mounting Type:Surface Mount, LPC2292FBD144,551 pinout, LPC2292FBD144,551 datasheet PDF, LPC2292FBD144,551 amp .Beyond Microcontrollers NXP Semiconductors LPC2292FBD144,551 ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors LPC2292FBD144,551


Microcontrollers NXP Semiconductors LPC2292FBD144,551 Overview

Introducing the LPC2292FBD144,551 from NXP Semiconductors, an advanced microcontroller that stands out in the dynamic market of embedded systems. This high-performance, versatile MCU is designed to meet the complex needs of modern electronic applications, offering a robust mix of processing power, memory options, and connectivity. Tailored for engineers and developers seeking a reliable and scalable solution, the LPC2292FBD144,551 embodies efficiency and adaptability in its feature-rich architecture. It is particularly well-suited for applications requiring a sophisticated interface and varied I/O operations, making it a prime choice for innovating next-generation technology products.

LPC2292FBD144,551 Features

The LPC2292FBD144,551 microcontroller features a 16/32-bit ARM7TDMI-S core, providing excellent computational speed and efficiency. With 256KB of onboard flash memory, it allows ample space for application code and data storage. The MCU also supports a wide range of communication protocols including multiple serial interfaces, enhancing its utility in complex digital systems. Its 144-LQFP package ensures a compact footprint while allowing for sufficient I/O ports and external interfacing, critical for multifaceted applications and devices.

LPC2292FBD144,551 Applications

  • Industrial Automation: Utilizes its robust processing capabilities and multiple I/O options to manage and control machinery and production processes efficiently.
  • Automotive Systems: Employs advanced interfacing features to integrate into vehicle diagnostics, infotainment, and advanced driver assistance systems (ADAS).
  • Home Automation: Leverages its connectivity features for smart home devices, enhancing user control and energy management.
  • Medical Devices: Takes advantage of its precision and reliability in monitoring systems and wearable health technology.
  • Telecommunications: Supports communication protocols that are essential for networking equipment and infrastructure.
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