LPC2141FBD64,151

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Peak Reflow Temperature (Cel) :

260

Power Supplies :

3.3V

Terminal Finish :

Tin (Sn)

JESD-609 Code :

e3

Core Processor :

ARM7®

RoHS Status :

ROHS3 Compliant

Length :

10mm

Packaging :

Tray

Program Memory Type :

Flash

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Supply Voltage-Min (Vsup) :

3V

Mounting Type :

Surface Mount

Core Size :

16/32-Bit

Data Converter :

A/D 6x10b

Terminal Form :

Gull wing

ROM (words) :

32768

Bit Size :

32

Supply Voltage-Max (Vsup) :

3.6V

Factory Lead Time :

12 Weeks

Surface Mount :

yes

DMA Channels :

No

HTS Code :

8542.31.00.01

RAM Size :

8K x 8

Height Seated (Max) :

1.6mm

JESD-30 Code :

S-PQFP-G64

Base Part Number :

LPC214*

Clock Frequency :

25MHz

Number of Terminations :

64

Speed :

60MHz

Program Memory Size :

32KB 32K x 8

PWM Channels :

yes

Voltage - Supply (Vcc/Vdd) :

3V~3.6V

Published :

2003

Terminal Pitch :

0.5mm

Time@Peak Reflow Temperature-Max (s) :

40

Supply Voltage :

3.3V

Has ADC :

yes

ECCN Code :

EAR99

Connectivity :

I2C, Microwire, SPI, SSI, SSP, UART/USART, USB

Supply Current-Max :

90mA

Pin Count :

64

Package / Case :

64-LQFP

Oscillator Type :

Internal

DAC Channels :

yes

Number of I/O :

45

Peripherals :

Brown-out Detect/Reset, POR, PWM, WDT

Width :

10mm

Operating Temperature :

-40°C~85°C TA

Series :

LPC2100

Terminal Position :

QUAD

Qualification Status :

Not Qualified