LPC2109FBD64/01,15

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Core Size :

16/32-Bit

Data Converter :

A/D 4x10b

Mounting Type :

Surface Mount

RAM Size :

8K x 8

Terminal Pitch :

0.5mm

JESD-30 Code :

S-PQFP-G64

RoHS Status :

ROHS3 Compliant

Bit Size :

32

Series :

LPC2100

Width :

10mm

Packaging :

Tray

Supply Voltage-Min (Vsup) :

1.65V

Qualification Status :

Not Qualified

Number of I/O :

46

PWM Channels :

yes

Package / Case :

64-LQFP

Pin Count :

64

Clock Frequency :

50MHz

Factory Lead Time :

12 Weeks

Connectivity :

I²C, IrDA, LINbus, SPI, UART/USART

Program Memory Size :

64KB 64K x 8

Height Seated (Max) :

1.6mm

JESD-609 Code :

e3

Supply Voltage-Max (Vsup) :

1.95V

Length :

10mm

Terminal Finish :

Tin (Sn)

Base Part Number :

LPC2109

DAC Channels :

No

Voltage - Supply (Vcc/Vdd) :

1.65V~3.6V

Published :

2003

Operating Temperature :

-40°C~85°C TA

Power Supplies :

1.83.3V

Program Memory Type :

Flash

DMA Channels :

No

Surface Mount :

yes

Speed :

60MHz

Time@Peak Reflow Temperature-Max (s) :

40

Core Processor :

ARM7®

Has ADC :

yes

ROM (words) :

65536

HTS Code :

8542.31.00.01

Terminal Position :

QUAD

Terminal Form :

Gull wing

Oscillator Type :

Internal

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Number of Terminations :

64

Peripherals :

POR, PWM, WDT

Supply Voltage :

1.8V

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Additional Feature :

ALSO REQUIRES 3.3V SUPPLY

Peak Reflow Temperature (Cel) :

260

ECCN Code :

EAR99