LPC1830FET256

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Bit Size :

32

Core Processor :

ARM® Cortex®-M3

ROM Programmability :

Flash

Program Memory Type :

ROMless

Peripherals :

Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT

Clock Frequency :

25MHz

Has ADC :

yes

Factory Lead Time :

12 Weeks

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

CPU Family :

CORTEX-M3

Source Url Status Check Date :

2013-06-14 00:00:00

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

PWM Channels :

yes

Number of Terminations :

256

DAC Channels :

yes

Surface Mount :

yes

Supply Voltage-Min (Vsup) :

2.2V

Height Seated (Max) :

1.55mm

Width :

17mm

Qualification Status :

Not Qualified

JESD-609 Code :

e1

Published :

2010

Oscillator Type :

Internal

Speed :

180MHz

Supply Voltage :

3.3V

Packaging :

Tray

JESD-30 Code :

S-PBGA-B256

Number of I/O :

164

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

External Data Bus Width :

32

RoHS Status :

ROHS3 Compliant

Voltage - Supply (Vcc/Vdd) :

2.2V~3.6V

Address Bus Width :

24

Terminal Form :

Ball

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Supply Voltage-Max (Vsup) :

3.6V

Pin Count :

256

Connectivity :

I²C, IrDA, LINbus, SPI, UART/USART

Core Size :

32-Bit

ROM (words) :

65536

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Data Converter :

A/D 8x10b; D/A 1x10b

DMA Channels :

yes

Mounting Type :

Surface Mount

Package / Case :

256-LBGA

RAM Size :

200K x 8

Terminal Position :

BOTTOM

Terminal Pitch :

1mm

Base Part Number :

LPC1830

Series :

LPC18xx

Power Supplies :

2.5/3.3V

Length :

17mm

Operating Temperature :

-40°C~85°C TA