LPC1810FET100,551

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Program Memory Type :

ROMless

Qualification Status :

Not Qualified

Clock Frequency :

25MHz

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

RoHS Status :

ROHS3 Compliant

Supply Voltage :

3.3V

Oscillator Type :

Internal

Package / Case :

100-TFBGA

PWM Channels :

No

ROM Programmability :

Flash

Width :

9mm

Supply Voltage-Max (Vsup) :

3.6V

Address Bus Width :

24

DAC Channels :

yes

Published :

2010

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

ROM (words) :

65536

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Speed :

150MHz

Supply Voltage-Min (Vsup) :

2.2V

Voltage - Supply (Vcc/Vdd) :

2V~3.6V

Number of I/O :

64

Data Converter :

A/D 12x10b; D/A 1x10b

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

JESD-30 Code :

S-PBGA-B100

Height Seated (Max) :

1.2mm

Factory Lead Time :

12 Weeks

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Power Supplies :

2.5/3.3V

Packaging :

Tray

Series :

LPC18xx

Core Processor :

ARM® Cortex®-M3

Connectivity :

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

Has ADC :

yes

Core Size :

32-Bit

DMA Channels :

yes

Peripherals :

Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT

Surface Mount :

yes

RAM Size :

136K x 8

Pin Count :

100

Number of Terminations :

100

Length :

9mm

Terminal Form :

Ball

Operating Temperature :

-40°C~85°C

Source Url Status Check Date :

2013-06-14 00:00:00

Terminal Pitch :

0.8mm

Mounting Type :

Surface Mount

External Data Bus Width :

32

Base Part Number :

LPC1810

CPU Family :

CORTEX-M3

Bit Size :

32

Terminal Position :

BOTTOM

JESD-609 Code :

e1