LPC1776FET180,551

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Factory Lead Time :

12 Weeks

Power Supplies :

3.3V

Width :

12mm

JESD-609 Code :

e1

Address Bus Width :

20

PWM Channels :

yes

Supply Voltage-Min (Vsup) :

2.4V

Voltage - Supply (Vcc/Vdd) :

2.4V~3.6V

Has ADC :

yes

DAC Channels :

yes

Core Size :

32-Bit

Package / Case :

180-TFBGA

EEPROM Size :

4K x 8

Base Part Number :

LPC1776

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Pitch :

0.8mm

Supply Voltage-Max (Vsup) :

3.6V

Clock Frequency :

25MHz

Terminal Position :

BOTTOM

Series :

LPC17xx

Length :

12mm

Packaging :

Tray

Pin Count :

180

Program Memory Size :

256KB 256K x 8

Peak Reflow Temperature (Cel) :

260

Surface Mount :

yes

Number of I/O :

141

JESD-30 Code :

S-PBGA-B180

DMA Channels :

yes

HTS Code :

8542.31.00.01

CPU Family :

CORTEX-M3

Program Memory Type :

Flash

Oscillator Type :

Internal

Number of Terminations :

180

Supply Voltage :

3.3V

Height Seated (Max) :

1.2mm

Published :

2010

Terminal Form :

Ball

Core Processor :

ARM® Cortex®-M3

Bit Size :

32

RAM Size :

80K x 8

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

RoHS Status :

ROHS3 Compliant

Data Converter :

A/D 8x12b; D/A 1x10b

Speed :

120MHz

External Data Bus Width :

16

Operating Temperature :

-40°C~85°C TA

Peripherals :

Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Qualification Status :

Not Qualified

Connectivity :

I²C, IrDA, LINbus, SPI, UART/USART

ECCN Code :

EAR99

ROM (words) :

262144

Mounting Type :

Surface Mount