LPC1765FET100,551

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

DAC Channels :

yes

Program Memory Type :

Flash

CPU Family :

CORTEX-M3

Package / Case :

100-TFBGA

Factory Lead Time :

12 Weeks

Number of Terminations :

100

Source Url Status Check Date :

2013-06-14 00:00:00

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Bit Size :

32

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Pin Count :

100

Clock Frequency :

25MHz

Mounting Type :

Surface Mount

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Program Memory Size :

256KB 256K x 8

Base Part Number :

LPC1765

Surface Mount :

yes

Connectivity :

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

Core Size :

32-Bit

Supply Voltage-Max (Vsup) :

3.6V

Series :

LPC17xx

DMA Channels :

yes

Operating Temperature :

-40°C~85°C TA

Qualification Status :

Not Qualified

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

PWM Channels :

yes

Terminal Pitch :

0.8mm

Length :

9mm

Power Supplies :

3.3V

JESD-609 Code :

e1

Packaging :

Tray

Number of I/O :

70

Published :

2009

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Speed :

100MHz

Width :

9mm

JESD-30 Code :

S-PBGA-B100

Voltage - Supply (Vcc/Vdd) :

2.4V~3.6V

Oscillator Type :

Internal

ROM (words) :

262144

Supply Voltage-Min (Vsup) :

2.4V

Has ADC :

yes

Data Converter :

A/D 8x12b; D/A 1x10b

Height Seated (Max) :

1.2mm

Core Processor :

ARM® Cortex®-M3

Supply Voltage :

3.3V

RAM Size :

64K x 8

Terminal Position :

BOTTOM

Peripherals :

Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT

Terminal Form :

Ball

RoHS Status :

ROHS3 Compliant