LPC1311FHN33

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Terminal Finish :

Nickel/Palladium/Gold (Ni/Pd/Au)

Core Size :

32-Bit

Speed :

72MHz

Surface Mount :

yes

Number of I/O :

28

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Series :

LPC13xx

JESD-609 Code :

e4

Peak Reflow Temperature (Cel) :

260

Core Processor :

ARM® Cortex®-M3

On Chip Program ROM Width :

8

Number of Terminations :

33

Mounting Type :

Surface Mount

Terminal Pitch :

0.65mm

Data Converter :

A/D 8x10b

Bit Size :

32

JESD-30 Code :

S-PQCC-N33

Operating Temperature :

-40°C~85°C TA

Power Supplies :

3.3V

Program Memory Type :

Flash

Package / Case :

32-VQFN Exposed Pad

Supply Voltage-Min (Vsup) :

2V

ROM (words) :

8192

DMA Channels :

No

ECCN Code :

EAR99

Packaging :

Tray

Program Memory Size :

8KB 8K x 8

Height Seated (Max) :

1mm

Qualification Status :

Not Qualified

RoHS Status :

ROHS3 Compliant

Terminal Form :

NO LEAD

RAM Size :

4K x 8

Length :

7mm

CPU Family :

ARM7

PWM Channels :

No

Voltage - Supply (Vcc/Vdd) :

2V~3.6V

Factory Lead Time :

12 Weeks

Published :

2006

HTS Code :

8542.31.00.01

Width :

7mm

Pin Count :

32

Oscillator Type :

Internal

Connectivity :

I²C, IrDA, LINbus, SPI, UART/USART

Peripherals :

Brown-out Detect/Reset, POR, WDT

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER

Base Part Number :

LPC1311

Supply Voltage-Max (Vsup) :

3.6V

Clock Frequency :

25MHz

Terminal Position :

QUAD

Supply Voltage :

3.3V

Has ADC :

yes

DAC Channels :

No

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED