LPC1311FHN33,551

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Mounting Type :

Surface Mount

DMA Channels :

No

Peak Reflow Temperature (Cel) :

260

Height Seated (Max) :

1mm

Program Memory Type :

Flash

Supply Voltage-Min (Vsup) :

2V

CPU Family :

ARM7

Voltage - Supply (Vcc/Vdd) :

2V~3.6V

Qualification Status :

Not Qualified

Core Processor :

ARM® Cortex®-M3

JESD-30 Code :

S-PQCC-N33

Terminal Position :

QUAD

Peripherals :

Brown-out Detect/Reset, POR, WDT

Connectivity :

I²C, IrDA, LINbus, SPI, UART/USART

HTS Code :

8542.31.00.01

Program Memory Size :

8KB 8K x 8

Number of Terminations :

33

ECCN Code :

EAR99

Core Size :

32-Bit

JESD-609 Code :

e4

Bit Size :

32

Has ADC :

yes

Surface Mount :

yes

Data Converter :

A/D 8x10b

Width :

7mm

Power Supplies :

3.3V

On Chip Program ROM Width :

8

Packaging :

Tray

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER

Pin Count :

32

Supply Voltage-Max (Vsup) :

3.6V

Speed :

72MHz

Clock Frequency :

25MHz

Factory Lead Time :

12 Weeks

Series :

LPC13xx

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

ROM (words) :

8192

Number of I/O :

28

DAC Channels :

No

PWM Channels :

No

Base Part Number :

LPC1311

Terminal Form :

NO LEAD

Terminal Pitch :

0.65mm

Length :

7mm

Operating Temperature :

-40°C~85°C TA

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Published :

2006

Supply Voltage :

3.3V

Package / Case :

32-VQFN Exposed Pad

RAM Size :

4K x 8

Oscillator Type :

Internal

RoHS Status :

ROHS3 Compliant

Terminal Finish :

Nickel/Palladium/Gold (Ni/Pd/Au)