LPC11A13FHI33/201,

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Mfr.Part #
LPC11A13FHI33/201,
Manufacturer
NXP Semiconductors
Package / Case
32-VFQFN Exposed Pad
Datasheet
Download
Description
IC MCU 32BIT 24KB FLASH 32HVQFN
Stock
425
In Stock :
425

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Manufacturer :
NXP Semiconductors
Product Category :
Microcontrollers
DMA Channels :
yes
Has ADC :
yes
PWM Channels :
yes
Power Supplies :
3.3V
Program Memory Type :
Flash
Packaging :
Tray
ROM (words) :
24576
Peripherals :
Brown-out Detect/Reset, POR, WDT
Height Seated (Max) :
0.85mm
Supply Voltage :
3.3V
CPU Family :
CORTEX-M0
Mounting Type :
Surface Mount
Data Converter :
A/D 8x10b; D/A 1x10b
Number of Terminations :
32
Supply Voltage-Max (Vsup) :
3.6V
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Series :
LPC11Axx
Speed :
50MHz
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
RAM (bytes) :
6144
Number of I/O :
28
JESD-30 Code :
S-PQCC-N32
HTS Code :
8542.31.00.01
Core Size :
32-Bit
Bit Size :
32
Supply Voltage-Min (Vsup) :
2.6V
DAC Channels :
yes
Voltage - Supply (Vcc/Vdd) :
2.6V~3.6V
Clock Frequency :
25MHz
Program Memory Size :
24KB 24K x 8
Width :
5mm
Oscillator Type :
Internal
RAM Size :
6K x 8
Pin Count :
32
EEPROM Size :
2K x 8
Core Processor :
ARM® Cortex®-M0
Terminal Pitch :
0.5mm
RoHS Status :
ROHS3 Compliant
Published :
2010
Additional Feature :
SEATED HGT-NOM
Length :
5mm
Connectivity :
I²C, IrDA, LINbus, SPI, UART/USART
Package / Case :
32-VFQFN Exposed Pad
Terminal Form :
NO LEAD
Factory Lead Time :
16 Weeks
Operating Temperature :
-40°C~85°C TA
Qualification Status :
Not Qualified
Surface Mount :
yes
Terminal Position :
QUAD
Introducing Microcontrollers NXP Semiconductors LPC11A13FHI33/201, from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Terminations:32, Package / Case:32-VFQFN Exposed Pad, Operating Temperature:-40°C~85°C TA, LPC11A13FHI33/201, pinout, LPC11A13FHI33/201, datasheet PDF, LPC11A13FHI33/201, amp .Beyond Microcontrollers NXP Semiconductors LPC11A13FHI33/201, ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors LPC11A13FHI33/201,


Microcontrollers NXP Semiconductors LPC11A13FHI33/201 Overview

Introducing the LPC11A13FHI33/201, a high-performance microcontroller from NXP Semiconductors, tailored for advanced applications requiring robust control and connectivity. This device is part of the wider LPC11xx series, renowned for its efficiency and reliability in complex electronics environments. The LPC11A13FHI33/201 microcontroller utilizes a 32-bit ARM Cortex-M0 processor, delivering the perfect balance between power consumption and processing capabilities. With 24KB of flash memory and a versatile 32HVQFN package, it offers a compact, yet powerful solution for a multitude of electronic applications. The integration of multiple features in such a small form factor ensures that the Microcontrollers NXP Semiconductors LPC11A13FHI33/201 remains a leading choice for engineers and developers aiming to enhance system performance while reducing development time and cost.

LPC11A13FHI33/201 Features

The LPC11A13FHI33/201 microcontroller boasts an array of features that make it highly adaptable and functional across various applications. It operates on a 32-bit ARM Cortex-M0 core, which ensures low power consumption while maintaining adequate processing power for intricate tasks. The MCU includes 24KB of flash memory, providing sufficient space for complex programs and algorithms. Its package, the 32HVQFN, is not only space-efficient but also conducive for streamlined PCB design. Moreover, this microcontroller supports multiple communication protocols, enhancing its utility in interconnected systems.

LPC11A13FHI33/201 Applications

  • Industrial Automation: The robust processing capabilities and support for multiple communication protocols make the LPC11A13FHI33/201 ideal for managing automated machinery and production lines, enhancing efficiency and reliability.
  • Smart Home Devices: Its low power consumption and compact design allow for integration into smart home ecosystems, where it can control and facilitate communication between various devices.
  • Wearable Technology: The LPC11A13FHI33/201's small form factor and efficiency are perfect for wearable devices, supporting extended battery life and complex functionalities without sacrificing performance.
  • Automotive Applications: Reliable and capable of operating under the rigorous conditions typical in automotive environments, this MCU can manage in-vehicle networking and sensor integration.
  • Consumer Electronics: It is an excellent choice for powering consumer electronics, offering the necessary processing power and memory capacity for user interfaces and connectivity features.
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