LFECP33E-3FN672C
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- Mfr.Part #
- LFECP33E-3FN672C
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 672-BBGA
- Datasheet
- Download
- Description
- IC FPGA 496 I/O 672FPBGA
- Stock
- 10,669
- In Stock ：
- 10,669
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Pbfree Code :
- yes
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Voltage - Supply :
- 1.14V~1.26V
- Number of Logic Blocks (LABs) :
- 4096
- Mounting Type :
- Surface Mount
- RoHS Status :
- RoHS Compliant
- Number of Logic Elements/Cells :
- 32800
- Radiation Hardening :
- No
- ECCN Code :
- EAR99
- Operating Supply Voltage :
- 1.2V
- Number of I/O :
- 496
- Series :
- ECP
- Package / Case :
- 672-BBGA
- Base Part Number :
- LFECP33
- RAM Size :
- 53kB
- Published :
- 2000
- Operating Temperature :
- 0°C~85°C TJ
- Packaging :
- Tray
- Number of Pins :
- 672
- Mount :
- Surface Mount
- Lead Free :
- Lead Free
- Total RAM Bits :
- 434176
- Frequency :
- 340MHz
- Pin Count :
- 672
- Memory Size :
- 78.6kB
- HTS Code :
- 8542.39.00.01
- Datasheets
- LFECP33E-3FN672C
FPGAs Lattice Semiconductor LFECP33E-3FN672C Overview
The FPGAs Lattice Semiconductor LFECP33E-3FN672C is a highly versatile and powerful FPGA (Field Programmable Gate Array) designed for sophisticated digital signal processing and high-speed logic operations. Manufactured by Lattice Semiconductor, a leader in programmable logic devices, this IC is engineered to meet the demands of high-performance applications across various industries. With an advanced architecture and ample I/O capabilities packaged in a 672FPBGA format, the LFECP33E-3FN672C stands out for its ability to drive complex, next-generation digital systems with efficiency and reliability.
LFECP33E-3FN672C Features
The LFECP33E-3FN672C FPGA offers an impressive array of features designed for flexible and high-capacity programming. Key features include:
- 496 I/O pins, providing expansive connectivity for a wide range of peripherals and devices.
- A compact 672-pin fine-pitch ball grid array (FPBGA) package that ensures a small footprint while allowing for robust physical connections.
- Highly efficient power management capabilities, making it suitable for energy-sensitive applications.
- Enhanced programmability and reconfigurability, enabling rapid prototyping and iterative design processes in R&D settings.
LFECP33E-3FN672C Applications
- Telecommunications: Used in the development of communication infrastructure equipment such as routers and switches, enhancing signal processing capabilities and network reliability.
- Automotive Electronics: Integrated into automotive systems for advanced driver-assistance systems (ADAS), infotainment, and vehicle-to-everything (V2X) communications, improving safety and user experience.
- Industrial Automation: Employs in controlling systems and automation technology for factories and industrial plants, providing the computational power needed for real-time processing and control.
- Consumer Electronics: Applied in the design of high-performance consumer electronics, including gaming consoles and smart home devices, enabling sophisticated user interfaces and connectivity solutions.
- Medical Devices: Vital in medical imaging systems and diagnostic equipment, ensuring rapid data processing and high-resolution imaging capabilities.
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