LFECP33E-3FN484C
- Mfr.Part #
- LFECP33E-3FN484C
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 484-BBGA
- Datasheet
- Download
- Description
- IC FPGA 360 I/O 484FBGA
- Stock
- 37,597
- In Stock :
- 37,597
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Mounting Type :
- Surface Mount
- Operating Supply Voltage :
- 1.2V
- Base Part Number :
- LFECP33
- Voltage - Supply :
- 1.14V~1.26V
- Max Frequency :
- 340MHz
- Number of Logic Elements/Cells :
- 32800
- HTS Code :
- 8542.39.00.01
- Pbfree Code :
- yes
- Pin Count :
- 484
- Mount :
- Surface Mount
- RoHS Status :
- RoHS Compliant
- Lead Free :
- Lead Free
- ECCN Code :
- EAR99
- RAM Size :
- 53kB
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Memory Size :
- 78.6kB
- Packaging :
- Tray
- Package / Case :
- 484-BBGA
- Operating Temperature :
- 0°C~85°C TJ
- Number of Logic Blocks (LABs) :
- 4096
- Published :
- 2000
- Series :
- ECP
- Total RAM Bits :
- 434176
- Number of I/O :
- 360
- Number of Pins :
- 484
- Datasheets
- LFECP33E-3FN484C

FPGAs Lattice Semiconductor LFECP33E-3FN484C Overview
The Lattice Semiconductor LFECP33E-3FN484C FPGA is a high-performance, field-programmable gate array that provides a versatile platform for a wide array of applications. This advanced FPGA offers a robust blend of power, flexibility, and cost-effectiveness, making it an ideal choice for designers looking to leverage the best of technology without compromising on scalability. The LFECP33E-3FN484C is equipped with 360 input/output ports housed in a compact 484-ball fine pitch ball grid array (FBGA) package, enabling dense and efficient system designs. This component is designed to meet the needs of sophisticated digital systems requiring high-speed data processing and high-volume data management, making it a cornerstone in the development of next-generation electronic devices.
LFECP33E-3FN484C Features
This FPGA from Lattice Semiconductor features 360 I/Os, providing ample connectivity for complex digital interactions in multi-functional devices. The 484FBGA packaging ensures a minimal footprint on system boards, which is essential for modern, compact device architectures. High integration capabilities allow for reduced development time and enhanced product performance, facilitating advanced system-on-chip (SoC) designs and the integration of multiple functionalities into a single chip.
LFECP33E-3FN484C Applications
- Telecommunications Infrastructure: The LFECP33E-3FN484C can be used to facilitate high-speed signal processing tasks within networking equipment, improving data throughput and reliability in complex telecom systems.
- Consumer Electronics: Ideal for use in high-performance consumer electronics, such as gaming consoles and high-definition video systems, where rapid data processing and enhanced graphical capabilities are required.
- Automotive Systems: Supports advanced driver-assistance systems (ADAS) by processing multiple data inputs from various sensors, aiding in real-time decision-making and vehicle automation.
- Industrial Automation: Can be integrated into control systems for manufacturing lines, providing the computational power needed for real-time machine control and monitoring, enhancing efficiency and safety.
- Medical Devices: Applied in the development of medical imaging systems, such as MRI and ultrasound scanners, where precise data processing is critical for accurate diagnostics.
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