LFECP33E-3F484C

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Mfr.Part #
LFECP33E-3F484C
Manufacturer
Lattice Semiconductor
Package / Case
484-BBGA
Datasheet
Download
Description
IC FPGA 360 I/O 484FBGA
Stock
25,196
In Stock :
25,196

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Voltage - Supply :
1.14V~1.26V
Number of Logic Blocks (LABs) :
4096
RoHS Status :
Non-RoHS Compliant
Base Part Number :
LFECP33
Operating Temperature :
0°C~85°C TJ
Number of I/O :
360
Mounting Type :
Surface Mount
Series :
ECP
Operating Supply Voltage :
1.2V
HTS Code :
8542.39.00.01
Published :
2000
Reach Compliance Code :
not_compliant
Pbfree Code :
No
Pin Count :
484
Memory Size :
78.6kB
ECCN Code :
EAR99
RAM Size :
53kB
Packaging :
Tray
Max Frequency :
340MHz
Number of Logic Elements/Cells :
32800
Package / Case :
484-BBGA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Mount :
Surface Mount
Number of Pins :
484
Total RAM Bits :
434176
Datasheets
LFECP33E-3F484C
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFECP33E-3F484C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:LFECP33, Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, Package / Case:484-BBGA, Number of Pins:484, LFECP33E-3F484C pinout, LFECP33E-3F484C datasheet PDF, LFECP33E-3F484C amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFECP33E-3F484C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFECP33E-3F484C


FPGAs Lattice Semiconductor LFECP33E-3F484C Overview

The FPGAs Lattice Semiconductor LFECP33E-3F484C is a high-performance, field-programmable gate array designed for advanced applications that require a robust I/O interface, featuring a versatile 484FBGA package. This IC FPGA is engineered to support complex digital systems with its 360 I/O capabilities, making it ideal for a wide range of industrial and commercial applications. The component is tailored to meet the rigorous demands of modern electronics, delivering reliability and performance that B2B customers can trust for mass deployment in critical systems.

LFECP33E-3F484C Features

This IC FPGA boasts numerous features that enhance its applicability in sophisticated electronics. Key features include its substantial I/O count of 360, which facilitates extensive interfacing with other components. The 484-ball fine-pitch ball grid array (FBGA) package ensures a compact form factor and excellent thermal performance, critical for high-density circuit designs.

LFECP33E-3F484C Applications

  • Telecommunications Equipment: Integrates seamlessly into systems requiring high-speed data transfer and signal processing.
  • Industrial Automation: Controls and manages complex machinery with high reliability and adaptability.
  • Automotive Electronics: Serves as a critical component in managing automotive sensors and control systems.
  • Consumer Electronics: Provides flexibility in multimedia devices for enhanced video and audio processing capabilities.
  • Medical Devices: Ensures accurate and reliable processing power in medical imaging and diagnostic equipment.
This content includes a detailed overview, features, and applications list that showcases how the LFECP33E-3F484C FPGA can be implemented across various technologies and industries, enhancing its appeal to B2B customers looking for versatile, high-performance components.
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