LFECP10E-3F484C
- Mfr.Part #
- LFECP10E-3F484C
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 484-BBGA
- Datasheet
- Download
- Description
- IC FPGA 288 I/O 484FBGA
- Stock
- 7,701
- In Stock :
- 7,701
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Operating Supply Voltage :
- 1.2V
- Voltage - Supply :
- 1.14V~1.26V
- Max Frequency :
- 340MHz
- Reach Compliance Code :
- not_compliant
- Package / Case :
- 484-BBGA
- Lead Free :
- Lead Free
- Mounting Type :
- Surface Mount
- Pin Count :
- 484
- Number of Logic Elements/Cells :
- 10200
- RAM Size :
- 34.5kB
- Operating Temperature :
- 0°C~85°C TJ
- Memory Size :
- 39.6kB
- Number of Logic Blocks (LABs) :
- 1280
- Number of I/O :
- 288
- Series :
- ECP
- Mount :
- Surface Mount
- ECCN Code :
- EAR99
- HTS Code :
- 8542.39.00.01
- Number of Pins :
- 484
- Published :
- 2000
- Base Part Number :
- LFECP10
- Packaging :
- Tray
- Pbfree Code :
- No
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- RoHS Status :
- Non-RoHS Compliant
- Total RAM Bits :
- 282624
- Datasheets
- LFECP10E-3F484C

FPGAs Lattice Semiconductor LFECP10E-3F484C Overview
The FPGAs Lattice Semiconductor LFECP10E-3F484C is a highly versatile and robust Field Programmable Gate Array (FPGA) designed for advanced integrated circuit applications. This component features a substantial array of 288 I/O pins, housed within a compact 484-ball fine pitch ball grid array (FBGA) package, ensuring significant flexibility in high-density circuit designs. The device is engineered to support a range of functionalities from simple logic operations to complex algorithm implementations, making it an ideal choice for designers looking for a scalable and efficient solution in electronics development.
LFECP10E-3F484C Features
This FPGA model from Lattice Semiconductor offers an array of features suited for high-performance applications. Key features include the extensive I/O interfacing capability, which allows for versatile connections to other components within a system. The 484FBGA packaging not only minimizes space on the printed circuit board but also enhances thermal management and reliability in operation. Furthermore, the device supports various logic configurations, providing engineers with the flexibility to customize their designs according to specific requirements and constraints.
LFECP10E-3F484C Applications
- Consumer Electronics: Utilized in devices such as smartphones, tablets, and gaming consoles to handle various signal processing tasks and connectivity solutions.
- Industrial Automation: Plays a critical role in industrial control systems, where precision and reliability are essential for managing automated processes and machinery.
- Automotive Systems: Applied in advanced driver-assistance systems (ADAS) to process real-time data from sensors and cameras, enhancing vehicle safety and performance.
- Telecommunication Infrastructure: Integral in the development of telecom hardware like routers and switches, facilitating efficient data flow and network management.
- Aerospace and Defense: Employed in navigation systems and onboard computers to perform robust data processing under extreme environmental conditions.
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