LFEC3E-4F256I
- Mfr.Part #
- LFEC3E-4F256I
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 256-BGA
- Datasheet
- Download
- Description
- IC FPGA 160 I/O 256FBGA
- Stock
- 28,087
- In Stock :
- 28,087
Request A Quote(RFQ)
- * Fullname:
- * Company:
- * E-Mail:
- Phone:
- Comment:
- * Quantity:
- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- ECCN Code :
- EAR99
- Operating Supply Voltage :
- 1.2V
- Peak Reflow Temperature (Cel) :
- 225
- Pin Count :
- 256
- Length :
- 17mm
- Terminal Pitch :
- 1mm
- Number of Logic Elements/Cells :
- 3100
- Width :
- 17mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Organization :
- 384 CLBS
- Base Part Number :
- LFEC3
- RAM Size :
- 6.9kB
- Number of Outputs :
- 160
- RoHS Status :
- Non-RoHS Compliant
- Terminal Position :
- BOTTOM
- JESD-609 Code :
- e0
- Terminal Form :
- Ball
- Combinatorial Delay of a CLB-Max :
- 0.48 ns
- Supply Voltage :
- 1.2V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Terminations :
- 256
- Height Seated (Max) :
- 2.1mm
- Voltage - Supply :
- 1.14V~1.26V
- Qualification Status :
- Not Qualified
- Power Supplies :
- 1.21.2/3.33.3V
- Series :
- EC
- Lead Free :
- Lead Free
- Mounting Type :
- Surface Mount
- Number of CLBs :
- 384
- Pbfree Code :
- No
- Memory Size :
- 8.4kB
- Packaging :
- Tray
- Published :
- 2008
- Mount :
- Surface Mount
- Operating Temperature :
- -40°C~100°C TJ
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Total RAM Bits :
- 56320
- Number of I/O :
- 160
- Number of Pins :
- 256
- Max Frequency :
- 378MHz
- Reach Compliance Code :
- not_compliant
- HTS Code :
- 8542.39.00.01
- Package / Case :
- 256-BGA
- Datasheets
- LFEC3E-4F256I

FPGAs Lattice Semiconductor LFEC3E-4F256I Overview
The FPGAs Lattice Semiconductor LFEC3E-4F256I is a highly versatile and powerful Field Programmable Gate Array (FPGA) designed for advanced digital circuit development. Manufactured by Lattice Semiconductor, a leader in smart connectivity solutions, this IC offers a robust platform for designing and deploying complex digital systems. Its 256FBGA package ensures a compact form factor while supporting a substantial number of I/O options, accommodating 160 inputs/outputs, making it ideal for applications requiring high-density integration and flexibility. This product’s architecture is specifically engineered to meet the evolving needs of modern technology sectors, providing the reliability and performance required to handle sophisticated digital computations and signal processing tasks.
LFEC3E-4F256I Features
The LFEC3E-4F256I FPGA is packed with features designed for efficiency and adaptability. Key features include its 256-ball fine pitch ball grid array (FBGA) package, which maximizes board space efficiency. Additionally, the device supports a wide range of logic density options, facilitating various degrees of complexity in custom logic circuits. The 160 I/O pins offer extensive connectivity, supporting multiple configuration schemes and allowing for versatile hardware integration. This FPGA is optimized for low power consumption, making it suitable for energy-sensitive applications while maintaining high performance.
LFEC3E-4F256I Applications
- Consumer Electronics: Used in devices like smart TVs and gaming consoles, where its ability to rapidly process multiple inputs and outputs enhances user experience and device functionality.
- Automotive Systems: Integrated into automotive infotainment and advanced driver-assistance systems (ADAS), providing the necessary computational power and connectivity to support real-time processing and decision-making.
- Industrial Automation: Plays a critical role in control systems and robotic applications, where reliability and adaptability to varying conditions are paramount.
- Communication Infrastructure: Utilized in communication equipment such as routers and switchers, where high-speed signal processing and data flow management are crucial for efficient network performance.
- Medical Devices: Applied in medical imaging systems and diagnostic instruments, enabling complex signal processing tasks that are essential for high-resolution images and accurate diagnostics.
You may place an order without registering to Chip IC. We strongly recommend that you log in before purchasing as you can track your order at any time.
RFQ (Request for Quotations)It is recommended to send RFQ to get the latest prices and stock availability about the part.Our sales will reply to your inquiry within 24 hours.
Payment MethodFor your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.
IMPORTANT NOTICEYou may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.
Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...
Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.
















