LFEC3E-4F256C

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Mfr.Part #
LFEC3E-4F256C
Manufacturer
Lattice Semiconductor
Package / Case
256-BGA
Datasheet
Download
Description
IC FPGA 160 I/O 256FBGA
Stock
34,644
In Stock :
34,644

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Series :
EC
Qualification Status :
Not Qualified
RAM Size :
6.9kB
Max Frequency :
378MHz
Mounting Type :
Surface Mount
Length :
17mm
Operating Supply Voltage :
1.2V
Pin Count :
256
Reach Compliance Code :
not_compliant
Package / Case :
256-BGA
Width :
17mm
Terminal Finish :
Tin/Lead (Sn63Pb37)
Published :
2008
Time@Peak Reflow Temperature-Max (s) :
30
JESD-609 Code :
e0
Mount :
Surface Mount
Pbfree Code :
No
HTS Code :
8542.39.00.01
Power Supplies :
1.21.2/3.33.3V
Number of Logic Blocks (LABs) :
384
Peak Reflow Temperature (Cel) :
225
Terminal Form :
Ball
RoHS Status :
Non-RoHS Compliant
Terminal Pitch :
1mm
Number of Logic Elements/Cells :
3100
Operating Temperature :
0°C~85°C TJ
Total RAM Bits :
56320
Number of Pins :
256
Lead Free :
Lead Free
Combinatorial Delay of a CLB-Max :
0.48 ns
Terminal Position :
BOTTOM
Voltage - Supply :
1.14V~1.26V
ECCN Code :
EAR99
Number of Terminations :
256
Supply Voltage :
1.2V
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Size :
8.4kB
Base Part Number :
LFEC3
Number of CLBs :
384
Number of I/O :
160
Height Seated (Max) :
2.1mm
Packaging :
Tray
Number of Outputs :
160
Datasheets
LFEC3E-4F256C
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFEC3E-4F256C from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:256-BGA, Operating Temperature:0°C~85°C TJ, Number of Pins:256, Number of Terminations:256, Base Part Number:LFEC3, LFEC3E-4F256C pinout, LFEC3E-4F256C datasheet PDF, LFEC3E-4F256C amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFEC3E-4F256C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFEC3E-4F256C


FPGAs Lattice Semiconductor LFEC3E-4F256C Overview

The Lattice Semiconductor LFEC3E-4F256C, a highly versatile and performance-oriented FPGA (Field Programmable Gate Array), offers a robust solution for designers focusing on innovation and rapid prototyping across a range of applications. This particular model is housed in a compact 256FBGA package and is designed to handle a variety of digital and mixed-signal applications. With its 160 I/O pins, it provides ample connectivity options, making it ideal for complex digital systems that require a high level of programmability and adaptability. The LFEC3E-4F256C FPGA is especially suited for developers looking to deploy systems with variable configurations and high-speed signal processing capabilities.

LFEC3E-4F256C Features

The LFEC3E-4F256C FPGA from Lattice Semiconductor is equipped with numerous features that make it a top choice for developers and engineers. Key features include its 256FBGA packaging that enables a dense yet accessible I/O layout, support for advanced digital signal processing, and a flexible logic architecture that allows for efficient reconfiguration. This FPGA's ability to support multiple design iterations without hardware changes accelerates development times and reduces cost, making it an excellent tool for both prototype development and full-scale production.

LFEC3E-4F256C Applications

  • Consumer Electronics: Utilized in devices such as smartphones and tablets for managing signal processing functions and battery management, ensuring efficient operation and enhanced device capabilities.
  • Automotive Systems: Applied in advanced driver-assistance systems (ADAS) to process multiple inputs from sensors and cameras, enabling real-time decision making and increased automotive safety.
  • Industrial Automation: Plays a crucial role in control systems for factories, optimizing operations through programmable logic controllers that adapt to varied automation tasks.
  • Telecommunications: Essential in the infrastructure of data centers and network operations centers, where rapid processing and reconfigurability support high-speed data transmission and switching.
  • Medical Devices: Integral to the development of medical imaging equipment, where it processes complex algorithms quickly to deliver precise and critical patient diagnostics.
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