LFEC33E-3FN484C

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Mfr.Part #
LFEC33E-3FN484C
Manufacturer
Lattice Semiconductor
Package / Case
484-BBGA
Datasheet
Download
Description
IC FPGA 360 I/O 484FBGA
Stock
8,526
In Stock :
8,526

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Logic Elements/Cells :
32800
Operating Temperature :
0°C~85°C TJ
Length :
23mm
Terminal Position :
BOTTOM
Number of Terminations :
484
Width :
23mm
Lead Free :
Lead Free
ECCN Code :
EAR99
Number of I/O :
360
Pbfree Code :
yes
Peak Reflow Temperature (Cel) :
250
Number of Pins :
484
Series :
EC
Qualification Status :
Not Qualified
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Supply Voltage :
1.2V
Operating Supply Voltage :
1.2V
JESD-609 Code :
e1
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Memory Size :
78.6kB
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Outputs :
360
HTS Code :
8542.39.00.01
Time@Peak Reflow Temperature-Max (s) :
40
Mounting Type :
Surface Mount
Total RAM Bits :
434176
RAM Size :
53kB
RoHS Status :
RoHS Compliant
Combinatorial Delay of a CLB-Max :
0.56 ns
Terminal Form :
Ball
Pin Count :
484
Frequency :
340MHz
Mount :
Surface Mount
Package / Case :
484-BBGA
Base Part Number :
LFEC33
Height Seated (Max) :
2.6mm
Packaging :
Tray
Voltage - Supply :
1.14V~1.26V
Power Supplies :
1.21.2/3.33.3V
Terminal Pitch :
1mm
Published :
2000
Number of Logic Blocks (LABs) :
4096
Datasheets
LFEC33E-3FN484C
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFEC33E-3FN484C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Number of Terminations:484, Number of Pins:484, Mounting Type:Surface Mount, Package / Case:484-BBGA, Base Part Number:LFEC33, LFEC33E-3FN484C pinout, LFEC33E-3FN484C datasheet PDF, LFEC33E-3FN484C amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFEC33E-3FN484C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFEC33E-3FN484C


FPGAs Lattice Semiconductor LFEC33E-3FN484C Overview

Introducing the FPGAs Lattice Semiconductor LFEC33E-3FN484C, a cutting-edge field programmable gate array (FPGA) that offers a high degree of flexibility and performance capabilities. This product is tailored for designers who require a robust array of logic cells combined with extensive I/O options, housed in a compact 484-ball fine pitch BGA package. As the demand for more dynamic and adaptable technologies grows, the LFEC33E-3FN484C stands out by providing a scalable, cost-effective solution for a multitude of complex digital applications.

LFEC33E-3FN484C Features

The LFEC33E-3FN484C by Lattice Semiconductor is engineered with essential features to accommodate the intricate needs of modern digital circuits. It boasts 360 programmable I/O pins, allowing ample connectivity for a wide range of peripherals and other integrated circuits. The FPGA is built for versatility, supporting various logic configurations that can be customized post-deployment. Additionally, its compact 484FBGA packaging ensures a minimal footprint on system boards, crucial for space-sensitive applications.

LFEC33E-3FN484C Applications

  • Telecommunications Equipment: The high I/O count and configurability make it ideal for use in routers, switches, and base station hardware, where adaptability and processing power are critical.
  • Automotive Electronics: Employed in vehicle infotainment systems and advanced driver assistance systems (ADAS), this FPGA can handle multiple inputs and outputs necessary for processing and controlling various in-car technologies.
  • Consumer Electronics: Perfect for smart home devices and high-performance gaming consoles, where rapid signal processing and interfacing with various multimedia sources are required.
  • Industrial Automation: Useful in controlling complex industrial machinery and robotic systems, providing the necessary logic and control functions for high-speed, precision operations.
  • Medical Devices: Applies in critical applications such as medical imaging systems and diagnostic equipment, where reliability and the ability to reconfigure for different tasks are paramount.
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