LFE3-70EA-8FN672I
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- Mfr.Part #
- LFE3-70EA-8FN672I
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 672-BBGA
- Datasheet
- Download
- Description
- IC FPGA 380 I/O 672FPBGA
- Stock
- 31,023
- In Stock ：
- 31,023
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- RAM Size :
- 552.5kB
- Number of Outputs :
- 380
- JESD-609 Code :
- e1
- Operating Temperature :
- -40°C~100°C TJ
- Operating Supply Current :
- 18mA
- Package / Case :
- 672-BBGA
- Terminal Form :
- Ball
- Length :
- 27mm
- Factory Lead Time :
- 8 Weeks
- Number of Pins :
- 672
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Number of I/O :
- 380
- HTS Code :
- 8542.39.00.01
- Voltage - Supply :
- 1.14V~1.26V
- Height Seated (Max) :
- 2.6mm
- Mount :
- Surface Mount
- Published :
- 2013
- Radiation Hardening :
- No
- Terminal Pitch :
- 1mm
- Pbfree Code :
- yes
- Width :
- 27mm
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Total RAM Bits :
- 4526080
- Memory Size :
- 570.6kB
- Peak Reflow Temperature (Cel) :
- 250
- Max Frequency :
- 500MHz
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- RoHS Status :
- ROHS3 Compliant
- Supply Voltage :
- 1.2V
- Number of Terminations :
- 672
- Lead Free :
- Lead Free
- Operating Supply Voltage :
- 1.2V
- Number of LABs/CLBs :
- 8375
- Series :
- ECP3
- Packaging :
- Tray
- Base Part Number :
- LFE3-70
- Pin Count :
- 672
- Mounting Type :
- Surface Mount
- Number of Logic Elements/Cells :
- 67000
- Terminal Position :
- BOTTOM
- Combinatorial Delay of a CLB-Max :
- 0.281 ns
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- ECCN Code :
- EAR99
- Datasheets
- LFE3-70EA-8FN672I
FPGAs Lattice Semiconductor LFE3-70EA-8FN672I Overview
The FPGAs Lattice Semiconductor LFE3-70EA-8FN672I is an advanced field programmable gate array designed for high-performance applications requiring flexible and rapid prototype capabilities. This integrated circuit by Lattice Semiconductor is built on a robust architecture that supports extensive logic density and I/O versatility. Housed in a 672-pin fine-pitch ball grid array (FPBGA) package, it offers superior integration in compact footprints. The product is especially suited for developers looking for customizable solutions that can be tailored swiftly to meet evolving design requirements, ensuring both scalability and efficiency in complex electronic environments.
LFE3-70EA-8FN672I Features
This FPGA boasts 380 I/O pins, allowing extensive peripheral and interfacing capabilities. With its high logic capacity and support for various standard and advanced I/O protocols, the LFE3-70EA-8FN672I excels in delivering flexibility and high-speed performance, making it ideal for a wide range of industrial and commercial applications. The FPGA also includes features like power optimization and security protocols, which ensure reliable and secure operations.
LFE3-70EA-8FN672I Applications
- Communications Equipment: The LFE3-70EA-8FN672I can be used in routers, switches, and base stations where high I/O count and processing capacity are necessary to manage large data flows efficiently.
- Industrial Automation: In PLCs and control systems, this FPGA aids in managing multiple input and output operations reliably under varying industrial conditions, enhancing process automation and system responsiveness.
- Automotive Technology: Suitable for automotive applications such as infotainment systems and advanced driver assistance systems (ADAS), where robust performance and high reliability are crucial.
- Consumer Electronics: This FPGA supports high-performance functionalities in devices such as high-definition multimedia interfaces and portable electronics, providing optimal performance and enhanced user experiences.
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