LFE3-17EA-8LFTN256C
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- Mfr.Part #
- LFE3-17EA-8LFTN256C
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 256-BGA
- Datasheet
- Download
- Description
- IC FPGA 133 I/O 256FTBGA
- Stock
- 11,655
- In Stock ：
- 11,655
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Terminal Pitch :
- 1mm
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Voltage - Supply :
- 1.14V~1.26V
- RAM Size :
- 87.5kB
- ECCN Code :
- EAR99
- Reach Compliance Code :
- not_compliant
- Peak Reflow Temperature (Cel) :
- 260
- Length :
- 17mm
- Qualification Status :
- Not Qualified
- JESD-609 Code :
- e1
- JESD-30 Code :
- S-PBGA-B256
- Clock Frequency :
- 500MHz
- HTS Code :
- 8542.39.00.01
- Number of LABs/CLBs :
- 2125
- Power Supplies :
- 1.2V
- Terminal Form :
- Ball
- Published :
- 2012
- Operating Temperature :
- 0°C~85°C TJ
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Base Part Number :
- LFE3-17
- Pin Count :
- 256
- Height Seated (Max) :
- 1.55mm
- Terminal Position :
- BOTTOM
- Number of Inputs :
- 133
- Total RAM Bits :
- 716800
- Number of Outputs :
- 133
- Number of Terminations :
- 256
- Number of Logic Elements/Cells :
- 17000
- RoHS Status :
- ROHS3 Compliant
- Packaging :
- Tray
- Combinatorial Delay of a CLB-Max :
- 0.281 ns
- Lead Free :
- Lead Free
- Factory Lead Time :
- 8 Weeks
- Series :
- ECP3
- Pbfree Code :
- yes
- Package / Case :
- 256-BGA
- Width :
- 17mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Mounting Type :
- Surface Mount
- Supply Voltage :
- 1.2V
- Mount :
- Surface Mount
- Number of I/O :
- 133
- Datasheets
- LFE3-17EA-8LFTN256C
FPGAs Lattice Semiconductor LFE3-17EA-8LFTN256C Overview
The LFE3-17EA-8LFTN256C from Lattice Semiconductor represents a sophisticated balance of performance and efficiency in the realm of field programmable gate arrays (FPGAs). Designed to deliver powerful flexibility, this device empowers engineers with a high-density, programmable architecture ideal for a diverse range of applications. The FPGA is housed in a compact 256FTBGA package, featuring 133 I/Os that provide substantial connectivity options for various design requirements. This specific model, tailored for optimizing logic density and I/O performance, is a prime choice for developers looking to harness FPGA technology for complex, next-generation digital circuits.
LFE3-17EA-8LFTN256C Features
The LFE3-17EA-8LFTN256C FPGA boasts a series of robust features that facilitate versatile applications across multiple domains. Key attributes include a high logic density, making it suitable for sophisticated digital processing tasks. Its 133 input/output pins enable broad interfacing capabilities, while its support for various standard and proprietary protocols ensures it can be seamlessly integrated into existing technology frameworks. The device is also designed for reduced power consumption, enhancing its suitability for power-sensitive applications.
LFE3-17EA-8LFTN256C Applications
- Telecommunications: Used in communication infrastructure, this FPGA can handle complex signal processing tasks, thus improving data flow and network reliability.
- Consumer Electronics: Integral to the development of consumer electronics, such as high-performance gaming consoles and smart home devices, where flexible I/O and processing power are crucial.
- Industrial Automation: Facilitates the control and management systems in automated production lines, enhancing operational efficiency and reliability.
- Automotive Technology: Employs advanced driver-assistance systems (ADAS) by managing multiple sensor inputs and real-time processing requirements.
- Medical Devices: Critical in medical imaging and diagnostic equipment, offering the necessary speed and adaptability for complex, real-time data processing.
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