LE9662WQCT

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Mfr.Part #
LE9662WQCT
Manufacturer
Microchip Technology
Package / Case
56-VFQFN Exposed Pad
Datasheet
Download
Description
IC TELECOM INTERFACE 56QFN
Stock
38,185
In Stock :
38,185

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Manufacturer :
Microchip Technology
Product Category :
Telecom
Mounting :
Surface Mount
Product Type :
Telecom Interface ICs
Terminal Pitch :
0.5 mm
Width :
8 mm
Voltage - Supply :
3.135V~3.465V
Length :
8 mm
Operating Supply Voltage :
3.3V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
RoHS Status :
ROHS3 Compliant
Factory Lead Time :
8 Weeks
Maximum Operating Supply Voltage :
3.465 Vdc
Operating Supply Current :
25mA
Interface :
4-Wire
Lifecycle Status :
IN PRODUCTION (Last Updated: 2 weeks ago)
Number of Circuits :
2
Package Shape :
Square
On-Chip Ring Relay Driver :
No
Number of Functions :
1
Current - Supply :
25mA
Terminal Position :
QUAD
Series :
miSLIC™
Supplier Device Package :
56-QFN (8x8)
Manufacturer :
Microchip
Brand :
Microchip Technology
Subcategory :
Interface ICs
Typical Operating Supply Voltage :
3.3 V
Product Category :
Telecom Interface ICs
Operating Temperature :
-40°C~85°C
Package / Case :
56-VFQFN Exposed Pad
Screening Level :
Industrial
Product Status :
Active
Polarity Reversal :
No
Seated Height-Max :
1 mm
Surface Mount :
yes
Reach Compliance Code :
Unknown
Number of Terminals :
56
Minimum Operating Supply Voltage :
3.135 Vdc
Pin Count :
56
Packaging :
Tape and Reel (TR)
RoHS :
Compliant
Temperature Grade :
Industrial
Mounting Type :
Surface Mount
Package :
Tape and Reel (TR)
Number of Channels per Chip :
2
Terminal Form :
NO LEAD
Base Product Number :
LE9662
Supplier Package :
QFN EP
Function :
Subscriber Line Interface Concept (SLIC)
Min Supply Voltage (DC) :
3.135V
On-Hook Transmission :
yes
JESD-30 Code :
S-XQCC-N56
Telecom IC Type :
SLIC
Datasheets
LE9662WQCT
Introducing Telecom Microchip Technology LE9662WQCT from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C, Package / Case:56-VFQFN Exposed Pad, Mounting Type:Surface Mount, LE9662WQCT pinout, LE9662WQCT datasheet PDF, LE9662WQCT amp .Beyond Telecom Microchip Technology LE9662WQCT ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

Microchip Technology LE9662WQCT


Telecom Microchip Technology LE9662WQCT Overview

The LE9662WQCT by Microchip Technology stands out in the telecom sector, offering robust interfacing solutions for communication applications. This Integrated Circuit (IC) is specifically designed to enhance the performance and reliability of telecom systems. The IC TELECOM INTERFACE 56QFN facilitates seamless integration into existing technology stacks, making it a versatile choice for manufacturers looking to upgrade or design telecom equipment. Its compact 56QFN package ensures minimal footprint while delivering optimal functionality, supporting large-scale deployments effectively.

LE9662WQCT Features

The LE9662WQCT IC offers a range of features suited for high-demand telecom applications. Key features include high integration capability that allows for reduced system complexity and increased reliability. The device is engineered to perform under the rigorous conditions typical in telecom environments, ensuring long-term stability and performance.

LE9662WQCT Applications

  • VoIP Systems: Integrates easily into Voice over IP technology to provide reliable voice transmission and reception, enhancing communication clarity and reducing latency.
  • PBX Systems: Utilized in Private Branch Exchange systems for efficient call routing and handling, improving the scalability and functionality of internal communication networks.
  • Telecom Switching: Essential in the operation of switching systems which require high reliability and performance consistency to manage multiple communications channels simultaneously.
This structured product description is designed to optimize on-page SEO and target B2B customers by highlighting the specific applications and capabilities of the LE9662WQCT, promoting its adoption in large-scale telecom projects.
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