LE78D110BVC

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Mfr.Part #
LE78D110BVC
Manufacturer
Microchip Technology
Package / Case
44-TQFP
Datasheet
Download
Description
IC TELECOM INTERFACE 44TQFP
Stock
34,139
In Stock :
34,139

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Manufacturer :
Microchip Technology
Product Category :
Telecom
Terminal Form :
Gull wing
Seated Height-Max :
1.2 mm
Terminal Finish :
MATTE TIN
Function :
Voice Over IP Processor
HTS Code :
8542.39.00.01
Noise-Max :
16 dBrnC
Packaging :
Tray
Voltage - Supply :
3.3V
Subcategory :
Analog Transmission Interfaces
Companding Law :
A/MU-LAW
Terminal Position :
QUAD
Manufacturer :
Zarlink Semiconductor Inc
Number of Terminals :
44
Number of Functions :
1
Number of Circuits :
1
Package / Case :
44-TQFP
Reach Compliance Code :
Unknown
Qualification Status :
Not Qualified
Number of Pins :
44
Supply Voltage :
3.3V
Current - Supply :
-
Package Shape :
Square
Surface Mount :
yes
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Pitch :
0.8mm
Number of Terminations :
44
Product Status :
Obsolete
Length :
10 mm
Temperature Grade :
Industrial
PSRR-Min :
37 dB
Width :
10 mm
JESD-609 Code :
e3
Mount :
Surface Mount
Package :
Tray
Telecom IC Type :
PCM CODEC
Contact Plating :
Tin
Hybrid :
2-4 CONVERSION
Filter :
yes
JESD-30 Code :
S-PQFP-G44
Interface :
PCM
Series :
-
RoHS Status :
ROHS3 Compliant
Mounting Type :
Surface Mount
Supplier Device Package :
44-TQFP (10x10)
Power Supplies :
3.3 V
Operating Temperature :
-40°C~85°C
Operating Mode :
SYNCHRONOUS
Datasheets
LE78D110BVC
Introducing Telecom Microchip Technology LE78D110BVC from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:44-TQFP, Number of Pins:44, Number of Terminations:44, Mounting Type:Surface Mount, Operating Temperature:-40°C~85°C, LE78D110BVC pinout, LE78D110BVC datasheet PDF, LE78D110BVC amp .Beyond Telecom Microchip Technology LE78D110BVC ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.



44 Terminations 44 Pin Telecom device 1 Circuits 1 Functions

LE78D110BVC Overview


A 44-TQFP package is used to reduce board space requirements.A Tray-packing method is used to pack telecommunications equipment.A Surface Mount-mount is used for mounting the telecom circuit.Telecom circuit is made up of 1 circuits.Providing 3.3V wtelecom IC's efficiencyh the correct supply voltage will improve efficiency.A -40°C~85°C-temperature setting offers reliable performance.The mounting is in the way of Surface Mount.Configuration of this telecom circuit has 44 terminations.There is a voltage supply called 3.3V that it uses.The telecom interface has 44 pins.The type of telecom IC it uses is PCM CODEC.An electric current of - is supplied to telecom equipment .The telecommunications device is part of the Analog Transmission Interfaces subcategory.With the - series electronic parts, it can perform similar functions of the telecommunication product .While designing, telecommunications device has 1 functions configured.

LE78D110BVC Features


Available in the 44-TQFP package
PCM CODEC as telecom IC type


LE78D110BVC Applications


There are a lot of Microchip Technology
LE78D110BVC Telecom applications.


  • Fractional T1/E1/J1
  • BITS Timing
  • Digital Access Cross-connect System (DACs)
  • Digital Cross-connect Systems (DCS)
  • Frame Relay Switches and Access Devices (FRADS)
  • ISDN Primary Rate Interfaces (PRA)
  • PBXs channel bank
  • PCM channel bank
  • T3 channelized access concentrators
  • M13 MUX
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