L777TSBH25POL2RM8
- Mfr.Part #
- L777TSBH25POL2RM8
- Manufacturer
- Amphenol Communications Solutions
- Package / Case
- Datasheet
- Download
- Description
- CONN D-SUB PLUG 25POS VERT SLDR
- Stock
- 52,920
- In Stock :
- 52,920
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- Manufacturer :
- Amphenol Communications Solutions
- Product Category :
- D-Sub Connector Assemblies
- Total Number of Contacts :
- 25
- Contact Material :
- COPPER ALLOY
- RoHS Status :
- RoHS Compliant
- Connector Type :
- Plug, Male Pins
- Number of Positions :
- 25
- Max Voltage Rating (AC) :
- 600V
- Orientation :
- Straight
- Number of Ports :
- 1
- Radiation Hardening :
- No
- Published :
- 2004
- Packaging :
- Tray
- DIN Conformance :
- No
- Mounting Type :
- Through Hole
- Number of Rows :
- 2
- Flange Feature :
- Mating Side, Female Screwlock (4-40)
- Current Rating :
- 5A
- Pbfree Code :
- yes
- Mount :
- Through Hole
- Connector Style :
- D-Sub
- Mixed Contacts :
- No
- Shell Material, Finish :
- Steel, Tin Plated
- Depth :
- 12.55mm
- Housing Material :
- Thermoplastic
- Termination :
- Solder
- Max Supply Voltage (AC) :
- 600V
- Feature :
- Board Lock, Grounding Indents
- Length :
- 53.04mm
- Factory Lead Time :
- 6 Weeks
- Series :
- TS
- UL Flammability Code :
- 94V-0
- Shell Finish :
- NICKEL/TIN
- Contact Form :
- Stamped
- Option :
- GENERAL PURPOSE
- Operating Temperature :
- -55°C~125°C
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Contact Type :
- Signal
- Dielectric Material :
- Thermoplastic, Glass Filled
- Empty Shell :
- No
- Shell Size, Connector Layout :
- 3 DB B
- Material Flammability Rating :
- UL94 V-0
- Filter Feature :
- No
- Contact Finish Thickness :
- 15.0μin 0.38μm
- IEC Conformance :
- No
- MIL Conformance :
- yes
- Pitch :
- 2.76mm
- Contact Finish :
- Gold
- JESD-609 Code :
- e4
- Datasheets
- L777TSBH25POL2RM8

TS Series D-Sub Plug, Male Pins 25-Position Signal Solder 3 DB B Through Hole Copper Alloy Gold Steel, Tin Plated
L777TSBH25POL2RM8 Overview
It comes in Plug, Male Pins packaging.There is a mounting type of Through Hole for this device.It is necessary to use a Tray case for packaging the product.This product is part of the TS Series.A variety of tasks can be managed through its 1 ports.In many ways, its Board Lock, Grounding Indents feature makes it more powerful.Through Hole is used to mount the part.In this case, the device operates at -55°C~125°C Operating Temperature.
L777TSBH25POL2RM8 Features
TS series
L777TSBH25POL2RM8 Applications
There are a lot of Amphenol ICC (Commercial Products)
L777TSBH25POL2RM8 D-Sub Connectors applications.
- Transportation
- Embedded systems
- Datacom
- Communication
- Medical technology
- Military Technology
- Measuring & Control Technology
- Instrumentation
- Automotive Electronics
- Telecommunications
You may place an order without registering to Chip IC. We strongly recommend that you log in before purchasing as you can track your order at any time.
RFQ (Request for Quotations)It is recommended to send RFQ to get the latest prices and stock availability about the part.Our sales will reply to your inquiry within 24 hours.
Payment MethodFor your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.
IMPORTANT NOTICEYou may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.
Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...
Shipping CostShipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.
The basic freight (for package ≤0.5 KG ) depends on the time zones and countries
Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.
















