JS28F00AP30BFA

Manufacturer :

Micron Technology

Product Category :

Memory

Mounting Type :

Surface Mount

Toggle Bit :

No

Memory Format :

Flash

Number of Pins :

56

Contact Plating :

Gold, Tin

Write Cycle Time - Word, Page :

110ns

Published :

2004

Peak Reflow Temperature (Cel) :

260

JESD-609 Code :

e3

Base Part Number :

28F00AP30

Organization :

64MX16

Page Size :

16words

Time@Peak Reflow Temperature-Max (s) :

30

Number of Functions :

1

Memory Interface :

Parallel

Memory Width :

16

Data Polling :

No

RoHS Status :

ROHS3 Compliant

Nominal Supply Current :

31mA

Terminal Finish :

Matte Tin (Sn)

Supply Voltage :

1.8V

Radiation Hardening :

No

Additional Feature :

BOTTOM BOOT

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Packaging :

Tray

Series :

Axcell™

Standby Current-Max :

0.00024A

Voltage :

1.7V

Number of Sectors/Size :

41023

Voltage - Supply :

1.7V~2V

Operating Temperature :

-40°C~85°C TA

Access Time (Max) :

110 ns

Length :

18.4mm

Memory Type :

Non-Volatile

Sector Size :

16K64K

Boot Block :

BOTTOM

Clock Frequency :

40MHz

Word Size :

16b

Operating Supply Voltage :

1.8V

Sync/Async :

ASYNCHRONOUS

Memory Size :

1Gb 64M x 16

Address Bus Width :

26b

Interface :

Parallel, Serial

Package / Case :

56-TFSOP (0.724, 18.40mm Width)

Surface Mount :

yes

Power Supplies :

1.81.8/3.3V

Height Seated (Max) :

1.2mm

Terminal Position :

Dual

Density :

1 Gb

Terminal Pitch :

0.5mm

Number of Terminations :

56