JAN1N6119

Manufacturer :

Microchip Technology

Product Category :

Power Line Protection :

No

Diode Element Material :

SILICON

Mounting Type :

Surface Mount

Operating Temperature :

-55°C~175°C TJ

Time@Peak Reflow Temperature-Max (s) :

20

Qualification Status :

Qualified

Terminal Form :

WRAP AROUND

Reverse Standoff Voltage :

27.4V

Number of Terminations :

2

Terminal Position :

END

Package / Case :

SQ-MELF, B

Number of Pins :

2

Test Current :

30mA

RoHS Status :

Non-RoHS Compliant

Peak Pulse Current :

10A

Pbfree Code :

No

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Max Reverse Leakage Current :

1μA

Pin Count :

2

Voltage - Breakdown (Min) :

32.49V

Mount :

Surface Mount

Lifecycle Status :

IN PRODUCTION (Last Updated: 1 month ago)

Bidirectional Channels :

1

Voltage - Reverse Standoff (Typ) :

27.4V

Current - Peak Pulse (10/1000μs) :

9.5A

Power Dissipation-Max :

5W

Applications :

GENERAL PURPOSE

Voltage - Clamping (Max) @ Ipp :

52.4V

Element Configuration :

Single

Clamping Voltage :

49.9V

Packaging :

Bulk

Case Connection :

Isolated

ECCN Code :

EAR99

Terminal Finish :

Tin/Lead (Sn/Pb)

Type :

Zener

Peak Reflow Temperature (Cel) :

225

Peak Pulse Power :

500W

Direction :

Bidirectional

Number of Elements :

1

JESD-609 Code :

e0

Series :

Military, MIL-PRF-19500/516

Published :

1997