JAN1N6119

Manufacturer :

Microchip Technology

Product Category :

Pin Count :

2

Published :

1997

Mounting Type :

Surface Mount

Reverse Standoff Voltage :

27.4V

Number of Terminations :

2

Voltage - Clamping (Max) @ Ipp :

52.4V

Current - Peak Pulse (10/1000μs) :

9.5A

Peak Pulse Power :

500W

Element Configuration :

Single

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Power Dissipation-Max :

5W

Max Reverse Leakage Current :

1μA

Mount :

Surface Mount

ECCN Code :

EAR99

Applications :

GENERAL PURPOSE

Voltage - Breakdown (Min) :

32.49V

Clamping Voltage :

49.9V

Peak Reflow Temperature (Cel) :

225

Lifecycle Status :

IN PRODUCTION (Last Updated: 1 month ago)

Terminal Form :

WRAP AROUND

Diode Element Material :

SILICON

RoHS Status :

Non-RoHS Compliant

Terminal Position :

END

Operating Temperature :

-55°C~175°C TJ

Time@Peak Reflow Temperature-Max (s) :

20

Peak Pulse Current :

10A

Voltage - Reverse Standoff (Typ) :

27.4V

Test Current :

30mA

Bidirectional Channels :

1

Number of Pins :

2

Package / Case :

SQ-MELF, B

Pbfree Code :

No

Qualification Status :

Qualified

Packaging :

Bulk

JESD-609 Code :

e0

Number of Elements :

1

Power Line Protection :

No

Terminal Finish :

Tin/Lead (Sn/Pb)

Case Connection :

Isolated

Type :

Zener

Direction :

Bidirectional

Series :

Military, MIL-PRF-19500/516