IXDN409PI
- Mfr.Part #
- IXDN409PI
- Manufacturer
- Littelfuse
- Package / Case
- 8-DIP (0.300, 7.62mm)
- Datasheet
- Download
- Description
- IC GATE DRVR LOW-SIDE 8DIP
- Stock
- 44,429
- In Stock :
- 44,429
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- Manufacturer :
- Littelfuse
- Product Category :
- Gate Drivers
- Terminal Form :
- THROUGH-HOLE
- Mount :
- Through Hole
- Input Type :
- Non-Inverting
- Series :
- --
- Manufacturer :
- IXYS Corporation
- RoHS Status :
- RoHS Compliant
- Interface IC Type :
- BUFFER OR INVERTER BASED MOSFET DRIVER
- Turn On Time :
- 0.04 µs
- Output Current :
- 9A
- JESD-30 Code :
- R-PDIP-T8
- Terminal Pitch :
- 2.54mm
- Logic Voltage - VIL, VIH :
- 0.8V 3.5V
- Number of Functions :
- 1
- Turn Off Time :
- 0.036 μs
- Nominal Supply Current :
- 3mA
- Weight :
- 599.989307mg
- Driven Configuration :
- Low-Side
- Mounting Type :
- Through Hole
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Seated Height-Max :
- 4.57 mm
- Package :
- Tube
- Number of Drivers :
- 1
- Terminal Finish :
- Matte Tin (Sn)
- Number of Terminations :
- 8
- Gate Type :
- IGBT, N-Channel, P-Channel MOSFET
- Reach Compliance Code :
- not_compliant
- Qualification Status :
- Not Qualified
- HTS Code :
- 8542.39.00.01
- Time@Peak Reflow Temperature-Max (s) :
- 35
- Rise / Fall Time (Typ) :
- 10ns 10ns
- Voltage - Supply :
- 4.5V~35V
- Lead Free :
- Lead Free
- Operating Temperature :
- -55°C~150°C TJ
- Number of Terminals :
- 8
- ECCN Code :
- EAR99
- Number of Pins :
- 8
- Package / Case :
- 8-DIP (0.300, 7.62mm)
- Height Seated (Max) :
- 4.57mm
- Propagation Delay :
- 40 ns
- Published :
- 2004
- Surface Mount :
- No
- Base Part Number :
- IXD*409
- Terminal Position :
- Dual
- Peak Reflow Temperature (Cel) :
- 260
- Supply Voltage :
- 18V
- Packaging :
- Tube
- Length :
- 9.59mm
- Turn On Delay Time :
- 40 ps
- Output Peak Current Limit-Nom :
- 9A
- High Side Driver :
- No
- Pin Count :
- 8
- Rise Time :
- 15ns
- Channel Type :
- Single
- Product Status :
- Obsolete
- Package Shape :
- RECTANGULAR
- Temperature Grade :
- Military
- Supplier Device Package :
- 8-PDIP
- Fall Time (Typ) :
- 15 ns
- Width :
- 7.62mm
- Current - Peak Output (Source, Sink) :
- 9A 9A
- Base Product Number :
- IXDN409
- JESD-609 Code :
- e3
- Max Output Current :
- 9A
- Datasheets
- IXDN409PI

Gate Drivers Littelfuse IXDN409PI Overview
Introducing the Gate Drivers Littelfuse IXDN409PI, an essential component for professionals seeking robust and reliable low-side gate driving solutions. Manufactured by Littelfuse, this IC gate driver is designed to efficiently manage power and switching in electronic circuits. Encased in an 8DIP package, it offers a streamlined integration into existing layouts, making it an ideal choice for high-performance applications. Its ability to drive MOSFETs and IGBTs with precision ensures optimal functioning of your electronic assemblies, promoting enhanced system reliability and performance.
IXDN409PI Features
The IXDN409PI gate driver is packed with features designed for high-efficiency and durable operation. Key attributes include its low drive impedance and fast switching capabilities, which help in reducing transition losses. The device also supports a wide range of input logic levels, making it versatile across various digital interfaces. Additionally, its built-in protection against over-current provides further reliability and safety, making it a trustworthy choice for critical applications.
IXDN409PI Applications
- Motor Control Systems: Utilizes its fast switching capabilities to enhance performance and efficiency in electric motor drivers.
- Power Converters: Provides reliable gate driving for MOSFETs and IGBTs used in DC-DC and AC-DC converters, ensuring stable operation.
- Renewable Energy Systems: Employs robust gate driving in solar inverters and wind turbine converters, optimizing energy conversion and grid performance.
- Automotive Applications: Drives components in electric vehicle powertrain systems, supporting advancements in automotive efficiency and emissions reductions.
- LED Lighting Systems: Used in high-power LED lighting setups, improving energy efficiency and reducing thermal footprint.
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