ISM330DLCTR

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Mfr.Part #
ISM330DLCTR
Manufacturer
STMicroelectronics
Package / Case
14-VFLGA Module
Datasheet
Download
Description
INEMO INERTIAL MODULE
Stock
94,833
In Stock :
94,833

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Manufacturer :
STMicroelectronics
Product Category :
Motion Sensors - IMUs (Inertial Measurement Units)
Factory Lead Time :
16 Weeks
JESD-30 Code :
R-PBGA-B14
Number of Terminations :
14
Packaging :
Tape and Reel (TR)
Length :
3mm
Output Type :
I2C, SPI
Height :
860μm
Series :
iNEMO
Width :
2.5mm
Max Supply Voltage :
3.6V
Min Supply Voltage :
1.62V
Lifecycle Status :
ACTIVE (Last Updated: 7 months ago)
Package / Case :
14-VFLGA Module
Terminal Pitch :
0.5mm
Terminal Position :
BOTTOM
Sensor Type :
Accelerometer, Gyroscope, Temperature, 6 Axis
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
RoHS Status :
RoHS Compliant
Base Part Number :
ISM3
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Operating Temperature :
-40°C~85°C TA
Surface Mount :
yes
Mounting Type :
Surface Mount
Number of Functions :
1
Analog IC - Other Type :
ANALOG CIRCUIT
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Terminal Form :
BUTT
Datasheets
ISM330DLCTR
Introducing Motion Sensors - IMUs (Inertial Measurement Units) STMicroelectronics ISM330DLCTR from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:14, Package / Case:14-VFLGA Module, Base Part Number:ISM3, Operating Temperature:-40°C~85°C TA, Mounting Type:Surface Mount, ISM330DLCTR pinout, ISM330DLCTR datasheet PDF, ISM330DLCTR amp .Beyond Motion Sensors - IMUs (Inertial Measurement Units) STMicroelectronics ISM330DLCTR ,we also offer LSM6DSRXTR, FSM305, ADIS16505-3BMLZ, Our vast inventory has you covered. Contact us now for immediate solutions.

STMicroelectronics ISM330DLCTR


ISM330DLCTR datasheet pdf and Motion Sensors - IMUs (Inertial Measurement Units) product details from STMicroelectronics stock available at

ISM330DLCTR Description


High-performance 3D digital accelerometer and 3D digital gyroscope are featured in the system-in-package known as the ISM330DLCTR, which is designed for Industry 4.0 applications.

The dependable and established MEMS sensor platform is used by ST's range of modules.

already-existing manufacturing techniques for micromachined an accelerometer and a gyroscope.

While the IC interfaces are created using CMOS technology, which enables the construction of a dedicated circuit that is trimmed to better match the sensing element's properties, the individual sensing elements are produced using specialized micromachining procedures.

The sensor components for the gyroscope and accelerometer are integrated on the same silicon die in the ISM330DLCTR, which ensures greater stability and robustness.



ISM330DLCTR Features


  • Smart FIFO up to 4 kbyte

  • Smart embedded functions and interrupts: tilt detection, free-fall, wakeup, 6D/4D orientation, click and double-click

  • Sensor hub feature to efficiently collect data from additional external sensors

  • Embedded hard, soft ironing for external magnetic sensor corrections

  • Embedded temperature sensor

  • Embedded self-test both for gyroscope and accelerometer

  • High shock survivability

  • Extended operating temperature range (-40 °C to +85 °C)

  • ECOPACK®, RoHS and “Green” compliant

  • 3D accelerometer with selectable full scale: ±2/±4/±8/±16 g

  • D gyroscope with selectable full scale: ±125/±250/±500/±1000/±2000 dps

  • Analog supply voltage: 1.71 V to 3.6 V

  • SPI & I²C serial interface with main processor data synchronization

  • Dedicated gyroscope output chain with low latency, low noise and dedicated low-pass filters for control loop stability (OIS and other stabilization applications)

  • Auxiliary SPI serial interface for independent, low-noise low-latency data output for gyroscope and accelerometer

  • Ultra-low power consumption for both accelerometer and gyroscope enabling long-lasting battery-operated applications: 0.5 mA in combo normal mode and 0.75 mA in combo high-performance mode



ISM330DLCTR Applications


  • Robotics, drones and industrial automation

  • Navigation systems and telematics

  • Vibration monitoring and compensation

  • Industrial IoT and connected devices

  • Antennas, platforms, and optical image and lens stabilization


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