IS61VF51236A-6.5B3
- Mfr.Part #
- IS61VF51236A-6.5B3
- Manufacturer
- Integrated Silicon Solution, Inc. (ISSI)
- Package / Case
- 165-TBGA
- Datasheet
- Download
- Description
- IC SRAM 18MBIT PARALLEL 165TFBGA
- Stock
- 34,082
- In Stock :
- 34,082
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- Manufacturer :
- Integrated Silicon Solution, Inc. (ISSI)
- Product Category :
- Memory
- Voltage - Supply :
- 2.375V~2.625V
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Standby Voltage-Min :
- 2.38V
- Operating Temperature :
- 0°C~70°C TA
- Number of Pins :
- 165
- I/O Type :
- COMMON
- Memory Density :
- 18874368 bit
- Memory Format :
- SRAM
- Mounting Type :
- Surface Mount
- Power Supplies :
- 2.5V
- Height Seated (Max) :
- 1.2mm
- Standby Current-Max :
- 0.06A
- Surface Mount :
- yes
- Number of Functions :
- 1
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Memory Size :
- 18Mb 512K x 36
- Access Time :
- 6.5ns
- Organization :
- 512KX36
- Supply Voltage-Min (Vsup) :
- 2.375V
- Memory Type :
- Volatile
- Clock Frequency :
- 133MHz
- Terminal Position :
- BOTTOM
- Supply Current-Max :
- 0.25mA
- Supply Voltage-Max (Vsup) :
- 2.625V
- RoHS Status :
- ROHS3 Compliant
- Pin Count :
- 165
- Packaging :
- Tray
- Supply Voltage :
- 2.5V
- Package / Case :
- 165-TBGA
- Memory Width :
- 36
- Terminal Pitch :
- 1mm
- Memory Interface :
- Parallel
- Qualification Status :
- Not Qualified
- Number of Terminations :
- 165
- HTS Code :
- 8542.32.00.41
- ECCN Code :
- 3A991.B.2.A
- Output Characteristics :
- 3-STATE
- Width :
- 13mm
- Length :
- 15mm
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Pbfree Code :
- No
- Additional Feature :
- PIPELINED ARCHITECTURE, FLOW-THROUGH
- JESD-609 Code :
- e0
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Datasheets
- IS61VF51236A-6.5B3
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Memory Integrated Silicon Solution, Inc. (ISSI) IS61VF51236A-6.5B3 Overview
The IS61VF51236A-6.5B3 by Integrated Silicon Solution, Inc. (ISSI) is a high-performance 18Mbit SRAM module designed for applications requiring fast access and high data integrity. This component is built using advanced technology to ensure optimal reliability and efficiency in a compact 165TFBGA package. Its robust design coupled with a fast access time makes it an ideal solution for enhancing system performance in demanding environments. Integrating this Memory ISSI product into your hardware architecture will support rigorous data operations and contribute to overall system stability, promoting high scalability and extended operational life for B2B customers.
IS61VF51236A-6.5B3 Features
The IS61VF51236A-6.5B3 SRAM boasts a parallel interface, offering a substantial 18Mbit of storage. Engineered in a fine-pitch 165TFBGA package, it provides a stable, yet high-speed data access solution, suitable for high-performance computing environments requiring rapid transaction speeds. This memory module features a 6.5ns access time, ensuring swift data retrieval and processing capabilities essential for advanced computing tasks.
IS61VF51236A-6.5B3 Applications
- Networking Equipment: Utilized in routers and switches for fast packet buffering, ensuring efficient data flow and minimal latency in communication networks.
- Telecommunications: Applied in telecom infrastructure to handle large-scale data transactions and real-time signal processing, enhancing the reliability and performance of communication services.
- High-Performance Computing (HPC): Ideal for servers and supercomputers where high-speed data access and processing are crucial for complex computations and large data set handling.
- Automotive Electronics: Used in advanced driver-assistance systems (ADAS) to quickly process information from vehicle sensors, improving response times and vehicle safety features.
- Industrial Automation: Supports robust control systems requiring rapid access to sensor data and real-time decision-making capabilities in automated production lines.
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