IS43DR82560B-3DBL
- Mfr.Part #
- IS43DR82560B-3DBL
- Manufacturer
- Integrated Silicon Solution, Inc. (ISSI)
- Package / Case
- 60-TFBGA
- Datasheet
- Download
- Description
- IC DRAM 2GBIT PARALLEL 60TWBGA
- Stock
- 35,258
- In Stock :
- 35,258
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- Manufacturer :
- Integrated Silicon Solution, Inc. (ISSI)
- Product Category :
- Memory
- Number of Terminations :
- 60
- Address Bus Width :
- 15b
- Pin Count :
- 60
- Write Cycle Time - Word, Page :
- 15ns
- Max Frequency :
- 333MHz
- Supply Voltage-Min (Vsup) :
- 1.7V
- Number of Pins :
- 60
- Access Time :
- 450ps
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Memory Format :
- DRAM
- Terminal Position :
- BOTTOM
- Mounting Type :
- Surface Mount
- Memory Interface :
- Parallel
- Voltage - Supply :
- 1.7V~1.9V
- Interleaved Burst Length :
- 48
- Operating Mode :
- SYNCHRONOUS
- Surface Mount :
- yes
- Additional Feature :
- AUTO/SELF REFRESH
- Supply Voltage-Max (Vsup) :
- 1.9V
- Operating Supply Voltage :
- 1.8V
- Memory Width :
- 8
- Output Characteristics :
- 3-STATE
- Density :
- 2 GB
- Supply Voltage :
- 1.8V
- ECCN Code :
- EAR99
- Packaging :
- Tray
- Length :
- 13mm
- I/O Type :
- COMMON
- Refresh Cycles :
- 8192
- HTS Code :
- 8542.32.00.36
- Qualification Status :
- Not Qualified
- Terminal Pitch :
- 0.8mm
- RoHS Status :
- ROHS3 Compliant
- Number of Ports :
- 1
- Organization :
- 256MX8
- Supply Current-Max :
- 0.417mA
- Sequential Burst Length :
- 48
- Memory Type :
- Volatile
- Memory Size :
- 2Gb 256M x 8
- Package / Case :
- 60-TFBGA
- Height Seated (Max) :
- 1.2mm
- Number of Functions :
- 1
- Operating Temperature :
- 0°C~85°C TC
- Standby Current-Max :
- 0.03A
- Datasheets
- IS43DR82560B-3DBL
Memory Integrated Silicon Solution, Inc. (ISSI) IS43DR82560B-3DBL Overview
The Memory Integrated Silicon Solution, Inc. (ISSI) IS43DR82560B-3DBL is a high-performance 2Gbit DRAM IC, engineered to meet the demanding requirements of intensive applications that require large memory densities and fast access times. This memory module utilizes a parallel interface and is packaged in a compact 60-ball TFBGA, offering efficient space utilization and improved thermal characteristics. Its robust design and high data integrity make it ideal for businesses looking to enhance their systems with reliable and scalable memory solutions.
IS43DR82560B-3DBL Features
This DRAM IC features a high-density 2Gbit storage capacity, providing substantial room for data-intensive applications. The parallel interface ensures high-speed data transfer rates, which is critical for performance-sensitive applications. Moreover, the compact 60-ball TFBGA package is designed for optimized power consumption and minimal footprint, making it suitable for a wide range of industrial and commercial applications.
IS43DR82560B-3DBL Applications
- Advanced Computing Systems: Utilized in server and high-performance computing platforms, this DRAM module enhances multi-threading and data processing capabilities.
- Telecommunication Equipment: Supports the high-speed, high-volume data handling required in switches, routers, and other networking equipment.
- Automotive Electronics: Employed in automotive infotainment systems, it provides the necessary speed and reliability for real-time data processing.
- Video Surveillance Systems: Ideal for storage in high-resolution video surveillance, ensuring smooth data capture and retrieval.
- Portable Electronics: Used in portable devices such as smartphones and tablets, enhancing user experience through fast access to stored information.
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