IDT71V432S6PF

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Mfr.Part #
IDT71V432S6PF
Manufacturer
Intersil (Renesas Electronics Corporation)
Package / Case
LQFP
Datasheet
Download
Description
IC SRAM 1MBIT PARALLEL 100TQFP
Stock
9,146
In Stock :
9,146

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Manufacturer :
Intersil (Renesas Electronics Corporation)
Product Category :
Memory
Output Enable :
yes
Time@Peak Reflow Temperature-Max (s) :
20
Memory Density :
1048576 bit
Terminal Position :
QUAD
Height Seated (Max) :
1.6mm
Access Time :
6ns
Length :
20mm
Access Time (Max) :
6 ns
Pin Count :
100
Series :
--
Voltage - Supply :
3.135 V ~ 3.63 V
Memory Format :
SRAM
Published :
2014
Terminal Form :
Gull wing
Width :
14mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Packaging :
Tray
Base Part Number :
IDT71V432
ECCN Code :
3A991.B.2.B
Memory Size :
1Mb (32K x 32)
JESD-30 Code :
R-PQFP-G100
Min Operating Temperature :
0°C
Mounting Type :
Surface Mount
Supply Voltage-Min (Vsup) :
3.135V
Temperature Grade :
COMMERCIAL
Reach Compliance Code :
not_compliant
Output Characteristics :
3-STATE
Organization :
32KX32
Memory Interface :
Parallel
Number of Functions :
1
Operating Mode :
SYNCHRONOUS
Standby Voltage-Min :
3.14V
Qualification Status :
Not Qualified
Clock Frequency :
83MHz
Package / Case :
LQFP
Standby Current-Max :
0.015A
Terminal Pitch :
0.65mm
Supply Voltage-Max (Vsup) :
3.63V
Number of Ports :
1
Operating Temperature :
0°C ~ 70°C (TA)
Peak Reflow Temperature (Cel) :
240
Max Operating Temperature :
70°C
Interface :
Parallel
Supply Voltage :
3.3V
Number of Terminations :
100
Terminal Finish :
Tin/Lead (Sn85Pb15)
Memory Type :
RAM, SRAM
Supply Current-Max :
0.18mA
Power Supplies :
3.3V
Memory Width :
32
Surface Mount :
yes
RoHS Status :
Non-RoHS Compliant
I/O Type :
COMMON
Write Cycle Time - Word, Page :
--
HTS Code :
8542.32.00.41
Supplier Device Package :
100-TQFP (14x14)
JESD-609 Code :
e0
Datasheets
IDT71V432S6PF
Introducing Memory Intersil (Renesas Electronics Corporation) IDT71V432S6PF from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:IDT71V432, Mounting Type:Surface Mount, Package / Case:LQFP, Operating Temperature:0°C ~ 70°C (TA), Number of Terminations:100, IDT71V432S6PF pinout, IDT71V432S6PF datasheet PDF, IDT71V432S6PF amp .Beyond Memory Intersil (Renesas Electronics Corporation) IDT71V432S6PF ,we also offer AT25SF081B-SSHB-T, AT25SF041B-SSHB-T, AT25SF041B-SHB-T, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil (Renesas Electronics Corporation) IDT71V432S6PF


Memory Intersil (Renesas Electronics Corporation) IDT71V432S6PF Overview

The Memory Intersil (Renesas Electronics Corporation) IDT71V432S6PF is an advanced high-speed static RAM (SRAM) designed for fast and reliable performance. This integrated circuit features a 1Mbit parallel interface, enclosed in a compact 100TQFP package, making it ideal for applications requiring high-speed data access and storage. The SRAM module is tailored for systems that demand low latency and high throughput, providing a robust solution for sophisticated digital systems. Its incorporation of advanced silicon technology from Intersil ensures reliability and performance, which is essential for B2B clients looking to incorporate high-quality components in their bulk product designs.

IDT71V432S6PF Features

The IDT71V432S6PF boasts several key features that enhance its usability and functionality in complex electronic systems. Key features include a large 1Mbit storage capacity, high-speed data retention using parallel access modes, and low-power consumption that extends the life of mobile and embedded applications. The chip's compatibility with a 100-pin TQFP packaging ensures easy integration into existing designs without the need for significant board redesigns.

IDT71V432S6PF Applications

  • Networking Equipment: Utilized in routers and switches for buffering and data queuing due to its high-speed access and reliability.
  • Industrial Control Systems: Serves as data storage for real-time process control where quick access to data is crucial.
  • Telecommunications: Used in telecommunications infrastructure to handle rapid signal processing and data flow management.
  • Automotive Electronics: Integral in advanced driver-assistance systems (ADAS) for real-time sensor data processing.
  • Medical Devices: Key component in medical imaging systems, storing high-resolution images and patient data securely and efficiently.
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