HC55185FCR

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Mfr.Part #
HC55185FCR
Manufacturer
Intersil
Package / Case
32-VQFN Exposed Pad
Datasheet
Download
Description
SLIC, 2-4 CONVERSION, BIPOLAR
Stock
715
In Stock :
715

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Manufacturer :
Intersil
Product Category :
Telecom
Number of Functions :
1
Number of Terminals :
32
Manufacturer :
Rochester Electronics LLC
Terminal Form :
NO LEAD
Peak Reflow Temperature (Cel) :
240
Terminal Pitch :
0.65 mm
Packaging :
Bulk
Mounting Type :
Surface Mount
Length :
7 mm
Package :
Bag
Package / Case :
32-VQFN Exposed Pad
RoHS :
Compliant
Current - Supply :
-
Interface :
-
Qualification Status :
Not Qualified
Product Status :
Obsolete
Function :
Subscriber Line Interface Concept (SLIC)
Seated Height-Max :
1 mm
Pbfree Code :
No
Operating Temperature :
0°C ~ 85°C
Lead Free :
Contains Lead
Telecom IC Type :
SLIC
Voltage - Supply :
-
Technology :
Bipolar
Reach Compliance Code :
Unknown
Supplier Device Package :
32-QFN (7x7)
Pin Count :
32
HTS Code :
8542.39.00.01
Series :
RSLIC18
Temperature Grade :
Other
Number of Circuits :
1
Number of Pins :
32
Package Shape :
Square
Surface Mount :
yes
Width :
7 mm
Terminal Position :
QUAD
JESD-30 Code :
S-PQCC-N32
Datasheets
HC55185FCR
Introducing Telecom Intersil HC55185FCR from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:32-VQFN Exposed Pad, Operating Temperature:0°C ~ 85°C, Number of Pins:32, HC55185FCR pinout, HC55185FCR datasheet PDF, HC55185FCR amp .Beyond Telecom Intersil HC55185FCR ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil HC55185FCR


Telecom Intersil HC55185FCR Overview

Introducing the Telecom Intersil HC55185FCR, a state-of-the-art SLIC (Subscriber Line Interface Circuit) specifically designed for 24-conversion applications within bipolar environments. This product is engineered by Intersil, a leader in high-performance semiconductors, ensuring top-tier reliability and efficiency. The HC55185FCR is tailored for robust telecommunications frameworks, providing exceptional signal integrity and reduced power consumption. Its compact design and bipolar capability make it a preferred choice for developers looking to enhance telecommunication infrastructures with minimal spatial and environmental impact.

HC55185FCR Features

The HC55185FCR boasts an array of features suited for demanding telecom applications. Key features include high integration which allows for reduced external components, enhanced thermal stability, and a bipolar design that ensures compatibility with both positive and negative signaling environments. Additionally, its capability to handle 24-channel conversions simultaneously makes it highly efficient for large-scale deployments.

HC55185FCR Applications

  • Telecommunication Networks: The HC55185FCR can be implemented in the core of telecom infrastructure to facilitate clear and stable voice transmission across multiple channels.
  • VoIP Systems: Ideal for Voice over IP applications, providing the necessary interface for converting analog voice signals into digital data for internet-based communication.
  • Private Branch Exchange (PBX) Systems: This SLIC can be used in PBX systems to manage internal telephony communications within organizations, ensuring reliable connectivity and scalability.
  • Integrated Access Devices: In devices that combine data and voice networking, the HC55185FCR serves as a crucial component for seamless service integration and delivery.
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