HC55185DIM

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Mfr.Part #
HC55185DIM
Manufacturer
Intersil
Package / Case
28-LCC (J-Lead)
Datasheet
Download
Description
SLIC, 2-4 CONVERSION, BIPOLAR
Stock
26,394
In Stock :
26,394

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Manufacturer :
Intersil
Product Category :
Telecom
Temperature Grade :
Industrial
Terminal Position :
QUAD
Peak Reflow Temperature (Cel) :
240
RoHS :
Non-Compliant
Packaging :
Bulk
Width :
11.505 mm
Pbfree Code :
No
Function :
Subscriber Line Interface Concept (SLIC)
Interface :
-
Length :
11.505 mm
Package :
Bag
Manufacturer :
Rochester Electronics LLC
Product Status :
Obsolete
Seated Height-Max :
4.57 mm
Surface Mount :
yes
Number of Functions :
1
JESD-609 Code :
e0
Lead Free :
Contains Lead
Terminal Finish :
TIN LEAD
Number of Pins :
28
Number of Terminals :
28
Supplier Device Package :
28-PLCC (11.51x11.51)
Current - Supply :
-
Package Shape :
Square
Terminal Form :
J BEND
Number of Circuits :
1
Technology :
Bipolar
Qualification Status :
Not Qualified
JESD-30 Code :
S-PQCC-J28
HTS Code :
8542.39.00.01
Operating Temperature :
-40°C ~ 85°C
Reach Compliance Code :
Unknown
Voltage - Supply :
-
Telecom IC Type :
SLIC
Series :
RSLIC18
Terminal Pitch :
1.27 mm
Pin Count :
28
Mounting Type :
Surface Mount
Package / Case :
28-LCC (J-Lead)
Datasheets
HC55185DIM
Introducing Telecom Intersil HC55185DIM from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:28, Operating Temperature:-40°C ~ 85°C, Mounting Type:Surface Mount, Package / Case:28-LCC (J-Lead), HC55185DIM pinout, HC55185DIM datasheet PDF, HC55185DIM amp .Beyond Telecom Intersil HC55185DIM ,we also offer CPC5712UTR, MT8870DS1, SI32176-C-FM1R, Our vast inventory has you covered. Contact us now for immediate solutions.

Intersil HC55185DIM


Telecom Intersil HC55185DIM Overview

The Telecom Intersil HC55185DIM, crafted by renowned manufacturer Intersil, is a state-of-the-art Subscriber Line Interface Circuit (SLIC) designed for superior performance in telecommunications. This device stands out in the market with its ability to handle 24 conversion processes, utilizing a bipolar technology that enhances signal clarity and reliability. The HC55185DIM is engineered to meet the rigorous demands of modern telecom applications, offering robust functionality that supports advanced telecommunication infrastructures. Its capacity for high-quality voice transmission and efficient power management makes it an essential component for developers looking to innovate and enhance their communication solutions.

HC55185DIM Features

This SLIC module boasts several key features including its bipolar signaling capability which ensures low signal distortion and high integrity voice transmission. The device’s 24 conversion ability is pivotal for complex telecommunication systems, providing flexible interfacing options and compatibility with multiple telephony standards. Additionally, the HC55185DIM offers excellent electrical characteristics under a range of operating conditions, making it highly reliable and efficient for sustained use.

HC55185DIM Applications

  • Residential Gateways: The HC55185DIM is ideal for deployment in residential gateways where reliable voice services are critical. It facilitates clear and stable telephony connections, enhancing user experience in home communication setups.
  • Enterprise PBX Systems: In enterprise environments, this SLIC can be integrated into Private Branch Exchange (PBX) systems to provide high-quality voice communications. Its robust design supports the complex needs of corporate telecommunication frameworks.
  • VoIP Equipment: Leveraging its high-performance conversion capabilities, the HC55185DIM excels in Voice over IP (VoIP) applications. It ensures smooth digital-to-analog conversions, crucial for maintaining voice quality over IP networks.
  • Rural Telecommunications: For rural areas where robust communication technology is necessary to overcome infrastructural challenges, the HC55185DIM provides reliable services. Its adaptability and resilience make it suitable for demanding environments and conditions.
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