G88MPB10002C1EU

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Mfr.Part #
G88MPB10002C1EU
Manufacturer
Amphenol Communications Solutions
Package / Case
Datasheet
Download
Description
CONN HEADER R/A 10POS 3MM
Stock
1,200
In Stock :
1,200

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Manufacturer :
Amphenol Communications Solutions
Product Category :
Headers, Male Pins
Moisture Sensitivity Level (MSL) :
1 (Unlimited)
Contact Plating :
Tin
Number of Rows :
1
Insulation Height :
0.172 4.37mm
Pitch :
2.9972mm
Contact Finish - Post :
Tin
Mounting Type :
Through Hole, Right Angle
Contact Finish - Mating :
Tin
Factory Lead Time :
8 Weeks
Connector Type :
Header
Termination :
Solder
Contact Type :
Male Pin
Shrouding :
Shrouded - 4 Wall
Insulation Material :
Liquid Crystal Polymer (LCP)
Number of Positions :
10
Published :
2015
Contact Finish Thickness - Mating :
100.0μin 2.54μm
Style :
Board to Cable/Wire
Contact Material :
COPPER ALLOY
Material Flammability Rating :
UL94 V-0
Fastening Type :
Locking Ramp
Insulation Color :
Black
RoHS Status :
RoHS Compliant
Feature :
Board Lock
Color :
Black
Mount :
Through Hole
Contact Finish Thickness - Post :
100.0μin 2.54μm
Number of Positions Loaded :
All
Packaging :
Tray
Contact Shape :
Square
Contact Length - Post :
0.083 2.11mm
Pitch - Mating :
0.118 3.00mm
Series :
Micro Power
Datasheets
G88MPB10002C1EU
Introducing Headers, Male Pins Amphenol Communications Solutions G88MPB10002C1EU from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Through Hole, Right Angle, G88MPB10002C1EU pinout, G88MPB10002C1EU datasheet PDF, G88MPB10002C1EU amp .Beyond Headers, Male Pins Amphenol Communications Solutions G88MPB10002C1EU ,we also offer 3220-20-0100-00, 3020-26-0300-00, 3220-26-0300-00-TR, Our vast inventory has you covered. Contact us now for immediate solutions.

Amphenol Communications Solutions G88MPB10002C1EU


Micro Power Series 1-Row Header Solder Copper Alloy Tray Through Hole, Right Angle Tin Liquid Crystal Polymer (LCP) 10-Position Board to Cable/Wire 0.172 4.37mm Height

G88MPB10002C1EU Overview


The product comes in a package of Header.Through Hole, Right Angle is the mount type.Tray cases are used to package the product.This product is in the Micro Power Series.As a result of its Board Lock feature, it possesses a great deal of power.There's a Through Hole on the part.

G88MPB10002C1EU Features


Micro Power series


G88MPB10002C1EU Applications


There are a lot of Amphenol ICC (Commercial Products)
G88MPB10002C1EU Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology
Purchase

You may place an order without registering to Chip IC. We strongly recommend that you log in before purchasing as you can track your order at any time.

RFQ (Request for Quotations)

It is recommended to send RFQ to get the latest prices and stock availability about the part.Our sales will reply to your inquiry within 24 hours.

Payment Method

For your convenience, we accept multiple payment methods in USD, Such as:PayPal, Credit Card, and wire transfer.

IMPORTANT NOTICE

You may place an order without registering to 1. You'll receive an order confirmations by e-mail soon . (Please remember to check the spam box if you didn't hear from us). 2. Since stock availability and prices may change at any time, the sales will reconfirm the order details and update you at soonest time.

Shipping Method

Most of our products are shipped via FEDEX,DHL,UPS and SF EXPRESS...

Shipping Cost

Shipping Cost starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).If customer have shipping account, we can make shipment under customer’s shipping account with freight collect directly.

The basic freight (for package ≤0.5 KG ) depends on the time zones and countries

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose. You can track it by the tracking no.

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