FDMF6706C
- Mfr.Part #
- FDMF6706C
- Manufacturer
- onsemi
- Package / Case
- 40-PowerTFQFN
- Datasheet
- Download
- Description
- MODULE DRMOS 40A 1000KHZ 40PQFN
- Stock
- 1,329
- In Stock :
- 1,329
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- Manufacturer :
- onsemi
- Product Category :
- Full Half-Bridge Drivers
- Number of Terminations :
- 40
- Series :
- XS™ DrMOS
- Weight :
- 224mg
- Voltage - Supply :
- 4.5V~5.5V
- Reach Compliance Code :
- not_compliant
- Factory Lead Time :
- 12 Weeks
- Number of Drivers :
- 2
- RoHS Status :
- ROHS3 Compliant
- Rds On (Typ) :
- 1 Ω LS, 1 Ω HS
- Length :
- 6mm
- Supply Voltage :
- 5V
- Base Part Number :
- FDMF6706
- Max Input Voltage :
- 5.5V
- Terminal Form :
- NO LEAD
- Packaging :
- Tape and Reel (TR)
- Fall Time (Typ) :
- 11 ns
- Lifecycle Status :
- ACTIVE (Last Updated: 2 days ago)
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Output Current :
- 40A
- Load Type :
- Inductive
- Output Voltage :
- 1V
- Operating Supply Current :
- 2mA
- Qualification Status :
- Not Qualified
- Terminal Position :
- QUAD
- Feature :
- Bootstrap Circuit, Status Flag
- Number of Pins :
- 40
- High Side Driver :
- yes
- Output Configuration :
- Half Bridge
- Applications :
- Synchronous Buck Converters
- Height :
- 1.1mm
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Published :
- 2014
- Interface :
- PWM
- Rise Time :
- 12ns
- Output Current per Channel :
- 40A
- Max Output Current :
- 40A
- REACH SVHC :
- No SVHC
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Fault Protection :
- Over Temperature, Shoot-Through, UVLO
- Operating Temperature :
- -40°C~150°C TJ
- Mount :
- Surface Mount
- Mounting Type :
- Surface Mount
- Number of Outputs :
- 1
- Number of Functions :
- 1
- Width :
- 6mm
- Voltage - Load :
- 3V~15V
- JESD-609 Code :
- e3
- ECCN Code :
- EAR99
- Package / Case :
- 40-PowerTFQFN
- Terminal Pitch :
- 0.5mm
- Min Input Voltage :
- 4.5V
- Pbfree Code :
- yes
- Terminal Finish :
- Tin (Sn)
- Datasheets
- FDMF6706C

Full Half-Bridge Drivers onsemi FDMF6706C Overview
Introducing the onsemi FDMF6706C, a cutting-edge Full Half-Bridge Driver designed to meet the rigorous demands of high-performance power management applications. This robust module integrates a driver and MOSFET into a compact 40PQFN package, capable of delivering up to 40A with a switching frequency as high as 1000 kHz. The FDMF6706C is engineered to provide efficient, reliable power conversion in space-constrained environments, making it a top choice for designers looking to enhance system performance while reducing overall footprint. Emphasizing thermal performance and high efficiency, this driver module is an essential component for any high-demand power application.
FDMF6706C Features
The FDMF6706C from onsemi features an integrated driver and MOSFET technology that ensures superior power handling capability and efficiency. Capable of operating at a frequency of up to 1000 kHz, it offers precise control over power delivery, enhancing the performance of electronic systems. Its compact 40PQFN package is ideally suited for applications where space is at a premium, providing a high degree of integration without sacrificing performance. Furthermore, its robust design is tailored to withstand the rigorous operational conditions typical in high-power applications.
FDMF6706C Applications
- Server Power Supplies: In the realm of server power supplies, the FDMF6706C facilitates efficient power management and high-density power applications, ensuring reliable operation under continuous high-load conditions.
- Telecommunication Equipment: This module is crucial for power supply solutions in telecommunication infrastructure, offering the resilience and efficiency needed for long-term, uninterrupted service.
- High-Performance Computing: Applied in high-performance computing systems, the FDMF6706C supports the demanding power requirements necessary to maintain optimal processing speeds and thermal management.
- Electric Vehicles: Utilized within electric vehicle power systems, it contributes to the effective distribution and management of power within the vehicle’s electronic subsystems, enhancing overall efficiency and reliability.
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