EPF10K250EFI672-3
- Mfr.Part #
- EPF10K250EFI672-3
- Manufacturer
- Altera (Intel)
- Package / Case
- 672-BBGA
- Datasheet
- Download
- Description
- IC FPGA 672FBGA
- Stock
- 5,349
- In Stock :
- 5,349
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Packaging :
- Tray
- Number of I/O :
- 470
- Mounting Type :
- Surface Mount
- Operating Temperature (Max) :
- 85°C
- Number of Logic Cells :
- 12160
- Temperature Grade :
- Industrial
- Power Supplies :
- 2.52.5/3.3V
- Programmable Logic Type :
- LOADABLE PLD
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Operating Temperature (Min) :
- -40°C
- Supply Voltage :
- 2.5V
- Package / Case :
- 672-BBGA
- RoHS Status :
- Non-RoHS Compliant
- JESD-609 Code :
- e0
- HTS Code :
- 8542.39.00.01
- Supply Voltage-Min (Vsup) :
- 2.3V
- Organization :
- 4 DEDICATED INPUTS, 470 I/O
- Supply Voltage-Max (Vsup) :
- 2.7V
- Number of Outputs :
- 470
- Series :
- FLEX-10KE®
- Output Function :
- MIXED
- Terminal Form :
- Ball
- Number of Inputs :
- 470
- JESD-30 Code :
- S-PBGA-B672
- Terminal Finish :
- TIN LEAD
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Terminal Position :
- BOTTOM
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Qualification Status :
- Not Qualified
- Surface Mount :
- yes
- Number of Terminations :
- 672
- Number of Dedicated Inputs :
- 4
- Reach Compliance Code :
- Compliant
- Terminal Pitch :
- 1mm
- Datasheets
- EPF10K250EFI672-3

FPGAs Altera (Intel) EPF10K250EFI672-3 Overview
The FPGAs Altera (Intel) EPF10K250EFI672-3 is a highly versatile and powerful field programmable gate array (FPGA) designed for advanced applications requiring substantial logic integration and high-speed processing. Manufactured by Intel's Altera division, this IC is encapsulated in a 672-pin FBGA package, offering a robust platform for developing complex digital circuits with enhanced configurability and adaptability. With its extensive logic elements and high I/O pin count, this FPGA enables designers to achieve high levels of system integration and performance optimization in a single chip, making it ideal for both prototyping and mass production scenarios.
EPF10K250EFI672-3 Features
This FPGA features a high-density integration of up to 250K logic elements and embedded memory blocks, supporting a wide range of digital and mixed-signal applications. Its high-speed transceiver lanes ensure rapid data transfer rates, essential for high-performance computing and telecommunications. Additionally, the EPF10K250EFI672-3 supports various I/O standards, providing flexibility in interfacing with other digital systems, and is compatible with Intel's sophisticated Quartus II development environment, simplifying design processes and reducing time to market.
EPF10K250EFI672-3 Applications
- Telecommunications: Utilized in routers and switches for data flow management and signal processing, enhancing network efficiency and bandwidth management.
- Data Centers: Serves as the backbone for servers and storage systems, enabling high-speed data processing and large-scale system integration to meet the demands of cloud computing and big data analytics.
- Automotive: Integrated into driver assistance systems and in-vehicle infotainment systems, providing the necessary computing power and connectivity for advanced vehicle automation and multimedia services.
- Industrial Automation: Employs in control systems and machine vision applications to enhance operational efficiency and precision in automated manufacturing environments.
- Aerospace and Defense: Used in satellite communications and avionics, ensuring robust performance and reliability under extreme conditions and critical applications.
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