EP4CE55F29C8LN

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Mfr.Part #
EP4CE55F29C8LN
Manufacturer
Altera (Intel)
Package / Case
780-BGA
Datasheet
Download
Description
IC FPGA 374 I/O 780FBGA
Stock
115
In Stock :
115

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Position :
BOTTOM
Power Supplies :
11.2/3.32.5V
Terminal Form :
Ball
Mounting Type :
Surface Mount
Number of I/O :
374
Time@Peak Reflow Temperature-Max (s) :
40
RoHS Status :
RoHS Compliant
Surface Mount :
yes
Width :
29mm
Package / Case :
780-BGA
Length :
29mm
Operating Temperature :
0°C~85°C TJ
Factory Lead Time :
8 Weeks
Qualification Status :
Not Qualified
Series :
Cyclone® IV E
JESD-609 Code :
e1
Terminal Pitch :
1mm
Total RAM Bits :
2396160
Number of Outputs :
377
HTS Code :
8542.39.00.01
Number of Inputs :
377
JESD-30 Code :
S-PBGA-B780
Height Seated (Max) :
2.4mm
Voltage - Supply :
0.97V~1.03V
Number of LABs/CLBs :
3491
Peak Reflow Temperature (Cel) :
245
Supply Voltage :
1V
Number of Logic Elements/Cells :
55856
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Base Part Number :
EP4CE55
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Packaging :
Tray
Number of Terminations :
780
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Clock Frequency :
362MHz
Datasheets
EP4CE55F29C8LN
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP4CE55F29C8LN from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:780-BGA, Operating Temperature:0°C~85°C TJ, Base Part Number:EP4CE55, Number of Terminations:780, EP4CE55F29C8LN pinout, EP4CE55F29C8LN datasheet PDF, EP4CE55F29C8LN amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP4CE55F29C8LN ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP4CE55F29C8LN


FPGAs Altera (Intel) EP4CE55F29C8LN Overview

The FPGAs Altera (Intel) EP4CE55F29C8LN is a highly capable integrated circuit specifically designed for applications requiring high-level digital processing and versatile I/O configurations. This FPGA from Intel's Altera division offers a robust platform for developers, thanks to its integration into a 780-pin FBGA (Fine-Pitch Ball Grid Array) package, which supports a dense arrangement of 374 I/O pins for extensive connectivity options. Ideal for developers looking to implement complex logic circuits and system-level designs, the EP4CE55F29C8LN delivers outstanding performance and flexibility, making it a preferred choice for high-demand applications.

EP4CE55F29C8LN Features

The EP4CE55F29C8LN FPGA is engineered with several key features that enhance its utility in a wide range of industrial and commercial applications. It supports a variety of logic synthesis tools and offers a rich set of programmable logic for tailored functionalities and specific use-case optimizations. Key features include a high density of logic elements, extensive memory integration, and support for high-speed transceiver data transfer, making it highly suitable for advanced digital computing tasks.

EP4CE55F29C8LN Applications

  • Consumer Electronics: Utilized in devices such as high-definition television sets and gaming consoles, the EP4CE55F29C8LN helps manage complex digital signal processing tasks, enhancing both performance and reliability.
  • Automotive: This FPGA can be used in automotive applications for controlling and managing sensors and actuators, improving vehicle dynamics and safety features.
  • Telecommunications: In telecommunication systems, the EP4CE55F29C8LN is essential for handling high-speed signal processing tasks, supporting both infrastructure and user-end equipment enhancements.
  • Industrial Automation: Ideal for automation systems, the FPGA performs in controlling machinery and processes, thus optimizing efficiency and productivity in industrial settings.
This HTML content provides a detailed overview, feature highlights, and specific applications for the EP4CE55F29C8LN FPGA, tailored to attract B2B clients interested in volume purchasing for diverse technological implementations.
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