EP3SL50F780C3

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Mfr.Part #
EP3SL50F780C3
Manufacturer
Altera (Intel)
Package / Case
780-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 488 I/O 780FBGA
Stock
12,671
In Stock :
12,671

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Mounting Type :
Surface Mount
Package / Case :
780-BBGA, FCBGA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of I/O :
488
Operating Temperature :
0°C~85°C TJ
RoHS Status :
RoHS Compliant
Total RAM Bits :
2184192
Number of Logic Elements/Cells :
47500
Voltage - Supply :
0.86V~1.15V
Number of LABs/CLBs :
1900
Series :
Stratix® III L
Datasheets
EP3SL50F780C3
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SL50F780C3 from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:780-BBGA, FCBGA, Operating Temperature:0°C~85°C TJ, EP3SL50F780C3 pinout, EP3SL50F780C3 datasheet PDF, EP3SL50F780C3 amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SL50F780C3 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP3SL50F780C3


FPGAs Altera (Intel) EP3SL50F780C3 Overview

The EP3SL50F780C3 by Altera (Intel) represents a cutting-edge solution in the realm of FPGAs (Field Programmable Gate Array), designed to meet the demanding needs of modern digital applications. This IC FPGA features a substantial 488 I/O pins packaged in a 780FBGA, making it highly capable for a wide range of applications, from complex digital processing to high-speed signal interfaces. Its robust configurability and scalability underscore its utility in high-performance environments where customization and speed are critical. The utilization of the FPGAs Altera (Intel) EP3SL50F780C3 in your designs ensures adaptability and power, enhancing both performance and efficiency.

EP3SL50F780C3 Features

This FPGA boasts a wide array of features designed to support high-level digital functionalities. Key attributes include its expansive array of 488 I/O pins, which facilitate extensive connectivity and versatility in integration. The 780FBGA package is optimized for a more reliable and effective thermal performance, ensuring stable operation under various thermal conditions. Additionally, the FPGA's high integration capabilities allow for a reduction in the overall number of components required in complex circuit designs, leading to cost efficiency and a reduced footprint.

EP3SL50F780C3 Applications

  • Data Centers: Utilizes its high I/O pin count for managing multiple data streams, effectively enhancing data processing capabilities and server reliability.
  • Telecommunications Equipment: Supports high-speed signal processing functions necessary for modern telecom infrastructures, improving bandwidth and data transfer rates.
  • Automotive Applications: Employs robust processing power to manage automotive safety systems, including advanced driver-assistance systems (ADAS), contributing to smarter and safer vehicle solutions.
  • Industrial Automation: Adapts easily to control systems, facilitating improvements in automation efficiency and precision in complex industrial environments.
  • Consumer Electronics: Serves as a core component in consumer devices requiring high-speed video and audio processing, elevating user experience through enhanced multimedia handling.
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