EP3SE50F780C2

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Mfr.Part #
EP3SE50F780C2
Manufacturer
Altera (Intel)
Package / Case
780-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 488 I/O 780FBGA
Stock
8,457
In Stock :
8,457

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Base Part Number :
EP3SE50
Number of Inputs :
488
Packaging :
Tray
Qualification Status :
Not Qualified
Width :
29mm
Mounting Type :
Surface Mount
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Series :
Stratix® III E
Terminal Position :
BOTTOM
Number of Terminations :
780
Package / Case :
780-BBGA, FCBGA
Number of LABs/CLBs :
1900
Terminal Form :
Ball
Operating Temperature :
0°C~85°C TJ
Clock Frequency :
800MHz
Voltage - Supply :
0.86V~1.15V
Terminal Pitch :
1mm
Supply Voltage :
0.9V
Number of Outputs :
488
Power Supplies :
1.2/3.3V
Height Seated (Max) :
3.5mm
RoHS Status :
RoHS Compliant
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Additional Feature :
IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Surface Mount :
yes
JESD-30 Code :
S-PBGA-B780
Number of I/O :
488
Total RAM Bits :
5760000
ECCN Code :
3A991
HTS Code :
8542.39.00.01
Length :
29mm
Number of Logic Elements/Cells :
47500
Datasheets
EP3SE50F780C2
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SE50F780C2 from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:EP3SE50, Mounting Type:Surface Mount, Number of Terminations:780, Package / Case:780-BBGA, FCBGA, Operating Temperature:0°C~85°C TJ, EP3SE50F780C2 pinout, EP3SE50F780C2 datasheet PDF, EP3SE50F780C2 amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SE50F780C2 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP3SE50F780C2


FPGAs Altera (Intel) EP3SE50F780C2 Overview

The FPGAs Altera (Intel) EP3SE50F780C2, a highly advanced field-programmable gate array (FPGA) from Intel's Altera series, is designed to meet the rigorous demands of modern digital circuits. This integrated circuit features a robust 780-pin fine-pitch ball grid array (FBGA) package, providing ample I/O pins (488 in total) for versatile connectivity. Ideal for applications requiring high-speed signal processing and flexible hardware configuration, the EP3SE50F780C2 enables designers to achieve high levels of performance and integration, facilitating the development of complex digital systems while reducing time-to-market and overall costs.

EP3SE50F780C2 Features

This FPGA offers a range of features that enhance its applicability in high-demand settings. Key features include its large array of 488 I/O pins, which allow for extensive interfacing with a wide range of peripheral devices. The device is built on Intel's advanced technology, providing superior speed and reliability. Additionally, the configuration and programming of the device are streamlined for ease of use, making it an ideal choice for both prototyping and production phases of development.

EP3SE50F780C2 Applications

  • Telecommunications: Used in communication equipment to process high-speed data transfers and signal conditioning. The FPGA's high I/O count and configurability make it ideal for routing and managing multiple data streams simultaneously.
  • Data Centers: Employs in server infrastructure to manage data flow and storage operations. Its ability to rapidly process large volumes of data enhances server efficiency and reliability.
  • Industrial Automation: Integral in controlling machinery and industrial processes. The FPGA can be programmed to handle complex control systems, improving precision and adaptability in automated environments.
  • Automotive Systems: Used in vehicle electronics for managing engine functions, sensor data, and in-car entertainment systems. The robust processing capabilities ensure reliable performance under varying environmental conditions.
  • Aerospace and Defense: Applied in navigation systems and avionic controls where high reliability and performance are critical. The FPGA's configurability allows for updates and adaptations to new technologies and requirements.
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