EP3SE260H780C2N

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Mfr.Part #
EP3SE260H780C2N
Manufacturer
Altera (Intel)
Package / Case
780-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 488 I/O 780HBGA
Stock
44,742
In Stock :
44,742

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Number of Terminations :
780
Power Supplies :
1.2/3.3V
Width :
33mm
Peak Reflow Temperature (Cel) :
245
Additional Feature :
IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY
Mounting Type :
Surface Mount
ECCN Code :
3A001.A.7.A
Packaging :
Tray
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Surface Mount :
yes
Package / Case :
780-BBGA, FCBGA
Voltage - Supply :
0.86V~1.15V
Number of LABs/CLBs :
10200
Total RAM Bits :
16672768
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Length :
33mm
Number of Outputs :
488
Clock Frequency :
800MHz
Operating Temperature :
0°C~85°C TJ
Height Seated (Max) :
3.5mm
RoHS Status :
RoHS Compliant
Series :
Stratix® III E
Number of I/O :
488
Number of Logic Elements/Cells :
255000
Time@Peak Reflow Temperature-Max (s) :
40
Supply Voltage :
0.9V
JESD-609 Code :
e1
JESD-30 Code :
S-PBGA-B780
Terminal Position :
BOTTOM
Terminal Pitch :
1mm
Qualification Status :
Not Qualified
Factory Lead Time :
8 Weeks
Base Part Number :
EP3SE260
HTS Code :
8542.39.00.01
Terminal Form :
Ball
Number of Inputs :
488
Datasheets
EP3SE260H780C2N
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SE260H780C2N from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:780, Mounting Type:Surface Mount, Package / Case:780-BBGA, FCBGA, Operating Temperature:0°C~85°C TJ, Base Part Number:EP3SE260, EP3SE260H780C2N pinout, EP3SE260H780C2N datasheet PDF, EP3SE260H780C2N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP3SE260H780C2N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP3SE260H780C2N


FPGAs Altera (Intel) EP3SE260H780C2N Overview

The FPGAs Altera (Intel) EP3SE260H780C2N stands at the forefront of FPGA technology, offering a robust platform for specialized applications in high-performance computing environments. Manufactured by Altera, now part of Intel, this FPGA (Field Programmable Gate Array) device is designed to deliver exceptional speed and flexibility. Featuring a dense 780-pin HBGA (Heat-Spread Ball Grid Array) packaging, it allows for efficient thermal management and space-saving board design, crucial for modern electronic devices. With a configuration of 488 I/O pins, it supports extensive peripheral integrations and complex digital interfacing, making it ideal for developers looking to push the limits of system design and integration.

EP3SE260H780C2N Features

The EP3SE260H780C2N FPGA is tailored for advanced system-level applications, where high data throughput and adaptability are paramount. It features high-density integration capabilities that cater to demanding processing tasks and multi-functional system deployments. Key features include:

  • High pin count (488 I/O) for versatile connectivity options.
  • Compact 780HBGA package for optimal space utilization and improved thermal characteristics.
  • Integrated DSP blocks enhance performance in signal processing and complex arithmetic functionalities.
  • Advanced security protocols for secure data management and intellectual property protection.
  • Supported by Intel's sophisticated Quartus software suite for easier development and deployment.

EP3SE260H780C2N Applications

  • Telecommunications Infrastructure: Utilized in routers and switches for data processing and signal integrity management.
  • Automotive Systems: Integral in driver assistance systems, providing the processing power needed for real-time decision-making.
  • Industrial Automation: Powers complex robotic systems, ensuring precision and adaptability in automated manufacturing processes.
  • Medical Devices: Key in diagnostic and imaging equipment, supporting advanced functionalities and data-intensive applications.
  • Defense and Aerospace: Used in avionics and radar systems, where high reliability and programmability are essential for mission-critical operations.
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