EP2SGX30DF780C3N
- Mfr.Part #
- EP2SGX30DF780C3N
- Manufacturer
- Altera (Intel)
- Package / Case
- 780-BBGA
- Datasheet
- Download
- Description
- IC FPGA 361 I/O 780FBGA
- Stock
- 2,121
- In Stock :
- 2,121
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Voltage - Supply :
- 1.15V~1.25V
- Peak Reflow Temperature (Cel) :
- 245
- JESD-609 Code :
- e1
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Number of Terminations :
- 780
- Height Seated (Max) :
- 3.5mm
- Factory Lead Time :
- 8 Weeks
- Terminal Position :
- BOTTOM
- ECCN Code :
- 3A991
- Terminal Form :
- Ball
- Number of Inputs :
- 361
- Number of LABs/CLBs :
- 1694
- Number of I/O :
- 361
- RoHS Status :
- RoHS Compliant
- Package / Case :
- 780-BBGA
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Surface Mount :
- yes
- Qualification Status :
- Not Qualified
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Packaging :
- Tray
- Combinatorial Delay of a CLB-Max :
- 4.45 ns
- Length :
- 29mm
- Number of Logic Elements/Cells :
- 33880
- Number of Outputs :
- 361
- Width :
- 29mm
- Series :
- Stratix® II GX
- Terminal Pitch :
- 1mm
- Power Supplies :
- 1.21.2/3.33.3V
- Total RAM Bits :
- 1369728
- HTS Code :
- 8542.39.00.01
- Supply Voltage :
- 1.2V
- Mounting Type :
- Surface Mount
- Clock Frequency :
- 717MHz
- Base Part Number :
- EP2SGX30
- Time@Peak Reflow Temperature-Max (s) :
- 40
- JESD-30 Code :
- S-PBGA-B780
- Operating Temperature :
- 0°C~85°C TJ
- Datasheets
- EP2SGX30DF780C3N

FPGAs Altera (Intel) EP2SGX30DF780C3N Overview
The FPGAs Altera (Intel) EP2SGX30DF780C3N is a highly versatile and powerful integrated circuit designed for applications requiring high-performance logic operations and flexible hardware configuration. Manufactured by Intel (formerly Altera), this FPGA device is encapsulated in a 780-pin FBGA package and supports 361 I/O pins, allowing for extensive connectivity and integration options. The EP2SGX30DF780C3N is engineered to deliver exceptional performance for complex digital computations, making it an ideal choice for developers and engineers looking to push the boundaries of technology in various industrial applications.
EP2SGX30DF780C3N Features
This FPGA unit boasts a robust set of features suitable for a wide range of applications. It offers a high-density integration capability which is crucial for compact yet powerful electronic systems. With its 780-pin fine-pitch ball grid array (FBGA) packaging, it ensures a reliable and efficient connection to printed circuit boards, critical for high-speed digital applications. The device also supports a wide array of logic design tasks with its substantial I/O capabilities, making it highly adaptable to evolving technological demands.
EP2SGX30DF780C3N Applications
- Telecommunications Infrastructure: Utilized in routers and switches, the EP2SGX30DF780C3N enhances processing capabilities and connectivity, managing high volumes of data transmission with ease.
- Automotive Driver Assistance Systems: In automotive applications, this FPGA can process multiple sensor data streams, contributing to enhanced safety features like collision detection and lane departure warnings.
- Medical Imaging Equipment: The FPGA's high processing power and I/O flexibility make it suitable for advanced medical imaging technologies, such as MRI and ultrasound scanners, improving image resolution and processing speeds.
- Industrial Automation: Ideal for control systems in manufacturing environments, the EP2SGX30DF780C3N can handle complex algorithms for machine control and real-time processing tasks.
- Aerospace and Defense: Used in radar and navigation systems, it provides the necessary speed and flexibility for high-frequency signal processing and real-time decision-making in critical situations.
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