EP2SGX30DF780C3N

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Mfr.Part #
EP2SGX30DF780C3N
Manufacturer
Altera (Intel)
Package / Case
780-BBGA
Datasheet
Download
Description
IC FPGA 361 I/O 780FBGA
Stock
2,121
In Stock :
2,121

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Voltage - Supply :
1.15V~1.25V
Peak Reflow Temperature (Cel) :
245
JESD-609 Code :
e1
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Number of Terminations :
780
Height Seated (Max) :
3.5mm
Factory Lead Time :
8 Weeks
Terminal Position :
BOTTOM
ECCN Code :
3A991
Terminal Form :
Ball
Number of Inputs :
361
Number of LABs/CLBs :
1694
Number of I/O :
361
RoHS Status :
RoHS Compliant
Package / Case :
780-BBGA
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Surface Mount :
yes
Qualification Status :
Not Qualified
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Packaging :
Tray
Combinatorial Delay of a CLB-Max :
4.45 ns
Length :
29mm
Number of Logic Elements/Cells :
33880
Number of Outputs :
361
Width :
29mm
Series :
Stratix® II GX
Terminal Pitch :
1mm
Power Supplies :
1.21.2/3.33.3V
Total RAM Bits :
1369728
HTS Code :
8542.39.00.01
Supply Voltage :
1.2V
Mounting Type :
Surface Mount
Clock Frequency :
717MHz
Base Part Number :
EP2SGX30
Time@Peak Reflow Temperature-Max (s) :
40
JESD-30 Code :
S-PBGA-B780
Operating Temperature :
0°C~85°C TJ
Datasheets
EP2SGX30DF780C3N
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP2SGX30DF780C3N from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:780, Package / Case:780-BBGA, Mounting Type:Surface Mount, Base Part Number:EP2SGX30, Operating Temperature:0°C~85°C TJ, EP2SGX30DF780C3N pinout, EP2SGX30DF780C3N datasheet PDF, EP2SGX30DF780C3N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP2SGX30DF780C3N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP2SGX30DF780C3N


FPGAs Altera (Intel) EP2SGX30DF780C3N Overview

The FPGAs Altera (Intel) EP2SGX30DF780C3N is a highly versatile and powerful integrated circuit designed for applications requiring high-performance logic operations and flexible hardware configuration. Manufactured by Intel (formerly Altera), this FPGA device is encapsulated in a 780-pin FBGA package and supports 361 I/O pins, allowing for extensive connectivity and integration options. The EP2SGX30DF780C3N is engineered to deliver exceptional performance for complex digital computations, making it an ideal choice for developers and engineers looking to push the boundaries of technology in various industrial applications.

EP2SGX30DF780C3N Features

This FPGA unit boasts a robust set of features suitable for a wide range of applications. It offers a high-density integration capability which is crucial for compact yet powerful electronic systems. With its 780-pin fine-pitch ball grid array (FBGA) packaging, it ensures a reliable and efficient connection to printed circuit boards, critical for high-speed digital applications. The device also supports a wide array of logic design tasks with its substantial I/O capabilities, making it highly adaptable to evolving technological demands.

EP2SGX30DF780C3N Applications

  • Telecommunications Infrastructure: Utilized in routers and switches, the EP2SGX30DF780C3N enhances processing capabilities and connectivity, managing high volumes of data transmission with ease.
  • Automotive Driver Assistance Systems: In automotive applications, this FPGA can process multiple sensor data streams, contributing to enhanced safety features like collision detection and lane departure warnings.
  • Medical Imaging Equipment: The FPGA's high processing power and I/O flexibility make it suitable for advanced medical imaging technologies, such as MRI and ultrasound scanners, improving image resolution and processing speeds.
  • Industrial Automation: Ideal for control systems in manufacturing environments, the EP2SGX30DF780C3N can handle complex algorithms for machine control and real-time processing tasks.
  • Aerospace and Defense: Used in radar and navigation systems, it provides the necessary speed and flexibility for high-frequency signal processing and real-time decision-making in critical situations.
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