EP2C70F896C6N

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Mfr.Part #
EP2C70F896C6N
Manufacturer
Altera (Intel)
Package / Case
896-BGA
Datasheet
Download
Description
IC FPGA 622 I/O 896FBGA
Stock
470
In Stock :
470

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Base Part Number :
EP2C70
Height Seated (Max) :
2.6mm
Package / Case :
896-BGA
Supply Voltage :
1.2V
Peak Reflow Temperature (Cel) :
260
Number of LABs/CLBs :
4276
Number of Logic Elements/Cells :
68416
Time@Peak Reflow Temperature-Max (s) :
40
Number of Outputs :
606
Series :
Cyclone® II
Surface Mount :
yes
Mounting Type :
Surface Mount
Terminal Pitch :
1mm
JESD-30 Code :
S-PBGA-B896
Additional Feature :
ALSO REQUIRES 3.3 SUPPLY
Packaging :
Tray
ECCN Code :
3A001.A.7.A
Length :
31mm
Factory Lead Time :
8 Weeks
HTS Code :
8542.39.00.01
Number of I/O :
622
Width :
31mm
Terminal Finish :
TIN SILVER COPPER
Voltage - Supply :
1.15V~1.25V
Number of Terminations :
896
Operating Temperature :
0°C~85°C TJ
Clock Frequency :
500MHz
JESD-609 Code :
e1
Total RAM Bits :
1152000
Number of Inputs :
622
RoHS Status :
RoHS Compliant
Terminal Position :
BOTTOM
Power Supplies :
1.21.5/3.33.3V
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Form :
Ball
Qualification Status :
Not Qualified
Datasheets
EP2C70F896C6N
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP2C70F896C6N from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:EP2C70, Package / Case:896-BGA, Mounting Type:Surface Mount, Number of Terminations:896, Operating Temperature:0°C~85°C TJ, EP2C70F896C6N pinout, EP2C70F896C6N datasheet PDF, EP2C70F896C6N amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP2C70F896C6N ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP2C70F896C6N


FPGAs (Field Programmable Gate Array) Altera (Intel) EP2C70F896C6N Overview

The Altera (Intel) EP2C70F896C6N IC FPGA stands as a versatile and high-performance component in the field of programmable logic devices. Designed to cater to demanding applications, this FPGA features a high-density grid array of 896 FBGA pins, enabling robust interfacing and integration capabilities. Its architecture allows for rapid prototyping and flexibility in design adaptations, making it an essential choice for developers looking to push the boundaries of digital circuit design. The inclusion of 622 I/O pins ensures extensive connectivity options, facilitating complex setups and large-scale integrations in industrial applications. This FPGA is particularly ideal for businesses seeking advanced technology solutions that require customizable logic to accommodate specific functionalities and performance criteria.

EP2C70F896C6N Features

The EP2C70F896C6N FPGA from Altera (Intel) is equipped with a rich set of features designed for scalability and high performance. The device's 622 input/output pins allow for a wide range of data and control signal handling, suitable for multifaceted systems. The 896 FBGA packaging not only ensures a compact form factor but also provides enhanced thermal management and reliability under varied operational conditions. This FPGA supports a multitude of configuration schemes, which simplifies system design and aids in faster deployment of technology solutions.

EP2C70F896C6N Applications

  • Telecommunications Infrastructure: Utilized in routers and switches for managing data traffic efficiently. The high I/O count supports complex signal processing tasks required in modern telecom networks.
  • Automotive Electronics: Deployed in vehicle control systems where multiple sensor inputs and actuator outputs are managed. Helps in improving the responsiveness and safety features of automotive systems.
  • Industrial Automation: Integral in control systems for manufacturing lines, enhancing precision and productivity through adaptable logic circuits.
  • Consumer Electronics: Used in high-definition multimedia interfaces and interactive devices, providing the necessary processing power and connectivity for enriched user experiences.
  • Medical Devices: Implements complex functionalities in medical imaging systems, ensuring rapid data processing capabilities essential for high-resolution diagnostics.
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