EP2C70F896C6

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Mfr.Part #
EP2C70F896C6
Manufacturer
Altera (Intel)
Package / Case
896-BGA
Datasheet
Download
Description
IC FPGA 622 I/O 896FBGA
Stock
293
In Stock :
293

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Time@Peak Reflow Temperature-Max (s) :
30
Number of Outputs :
606
JESD-609 Code :
e0
Qualification Status :
Not Qualified
JESD-30 Code :
S-PBGA-B896
Terminal Form :
Ball
Surface Mount :
yes
RoHS Status :
Non-RoHS Compliant
Terminal Finish :
TIN LEAD
Package / Case :
896-BGA
Number of LABs/CLBs :
4276
Clock Frequency :
500MHz
Number of Terminations :
896
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of I/O :
622
Additional Feature :
ALSO REQUIRES 3.3 SUPPLY
Operating Temperature :
0°C~85°C TJ
Packaging :
Tray
ECCN Code :
3A001.A.7.A
Power Supplies :
1.21.5/3.33.3V
Peak Reflow Temperature (Cel) :
220
HTS Code :
8542.39.00.01
Base Part Number :
EP2C70
Width :
31mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Supply Voltage :
1.2V
Number of Logic Elements/Cells :
68416
Terminal Pitch :
1mm
Length :
31mm
Mounting Type :
Surface Mount
Factory Lead Time :
8 Weeks
Voltage - Supply :
1.15V~1.25V
Series :
Cyclone® II
Total RAM Bits :
1152000
Height Seated (Max) :
2.6mm
Terminal Position :
BOTTOM
Number of Inputs :
622
Datasheets
EP2C70F896C6
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP2C70F896C6 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:896-BGA, Number of Terminations:896, Operating Temperature:0°C~85°C TJ, Base Part Number:EP2C70, Mounting Type:Surface Mount, EP2C70F896C6 pinout, EP2C70F896C6 datasheet PDF, EP2C70F896C6 amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP2C70F896C6 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP2C70F896C6


FPGAs Altera (Intel) EP2C70F896C6 Overview

Introducing the high-performance FPGAs Altera (Intel) EP2C70F896C6, a critical component designed for sophisticated digital circuit development. This IC FPGA from Altera, now part of Intel's innovative semiconductor portfolio, features a robust 896FBGA package, enabling a compact form factor while accommodating an impressive 622 I/O for versatile connectivity options. This FPGA is tailored for designers who require a mix of high-speed logic, substantial I/O interfacing, and extensive memory capabilities in areas such as data processing, communication infrastructure, and consumer electronics.

EP2C70F896C6 Features

The EP2C70F896C6 FPGA offers a diverse range of features suitable for a variety of demanding applications. Key attributes include its substantial I/O count of 622, allowing for flexible interfacing with a wide range of peripheral devices. The 896-pin fine-pitch ball grid array (FBGA) package ensures a minimal footprint on system boards, making it ideal for dense, integrated applications. Additionally, this FPGA benefits from Altera's leading-edge technology providing programmable logic for high-speed computations and data manipulation.

EP2C70F896C6 Applications

  • Telecommunications Equipment: Utilizes its high I/O capabilities to manage multiple communication interfaces, enhancing signal processing and data throughput for routers and switches.
  • Automotive Systems: Employs advanced logic to control and integrate various automotive functions, including sensor data management and real-time system responses in advanced driver-assistance systems (ADAS).
  • Video Processing: Takes
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