EP2C70F672C8

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Mfr.Part #
EP2C70F672C8
Manufacturer
Altera (Intel)
Package / Case
672-BGA
Datasheet
Download
Description
IC FPGA 422 I/O 672FBGA
Stock
1,435
In Stock :
1,435

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
JESD-30 Code :
S-PBGA-B672
ECCN Code :
3A991
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Operating Temperature :
0°C~85°C TJ
Package / Case :
672-BGA
Voltage - Supply :
1.15V~1.25V
Width :
27mm
Base Part Number :
EP2C70
Time@Peak Reflow Temperature-Max (s) :
30
Terminal Form :
Ball
Series :
Cyclone® II
Number of Logic Elements/Cells :
68416
HTS Code :
8542.39.00.01
Terminal Pitch :
1mm
Number of LABs/CLBs :
4276
Additional Feature :
ALSO REQUIRES 3.3 SUPPLY
Peak Reflow Temperature (Cel) :
220
RoHS Status :
Non-RoHS Compliant
Power Supplies :
1.21.5/3.33.3V
Height Seated (Max) :
2.6mm
Length :
27mm
Number of Terminations :
672
Qualification Status :
Not Qualified
Factory Lead Time :
8 Weeks
Packaging :
Tray
JESD-609 Code :
e0
Mounting Type :
Surface Mount
Surface Mount :
yes
Terminal Position :
BOTTOM
Clock Frequency :
402.5MHz
Number of Outputs :
406
Total RAM Bits :
1152000
Terminal Finish :
TIN LEAD
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Supply Voltage :
1.2V
Number of I/O :
422
Number of Inputs :
422
Datasheets
EP2C70F672C8
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP2C70F672C8 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Package / Case:672-BGA, Base Part Number:EP2C70, Number of Terminations:672, Mounting Type:Surface Mount, EP2C70F672C8 pinout, EP2C70F672C8 datasheet PDF, EP2C70F672C8 amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP2C70F672C8 ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP2C70F672C8


FPGAs Altera (Intel) EP2C70F672C8 Overview

The FPGas Altera (Intel) EP2C70F672C8 integrates superior performance and flexibility through its advanced architecture designed for a wide range of uses. Developed by Altera, now part of Intel, this IC FPGA features 422 I/O pins housed in a 672FBGA package, ensuring ample connectivity and space-saving integration for complex digital systems. Its high functionality and adaptability make it ideal for designers looking to push the limits of hardware acceleration and digital processing capabilities. The EP2C70F672C8 is a perfect choice for enterprises needing robust solutions to handle complex computations and achieve high-speed operational efficiency. This product is designed to support rapid prototyping and scalable integration, suiting a variety of industrial applications.

EP2C70F672C8 Features

The EP2C70F672C8 from Altera (Intel) boasts an impressive array of features designed for versatile applications. Key features include a robust 422 I/O capability, housed within a compact 672-pin Fine Ball Grid Array (FBGA). The device supports extensive logic utilization, high-speed DSP blocks, and memory interfaces, all of which are critical for developing high-performance, multi-functional devices. Its programmability allows for updates and reconfiguration, ensuring long-term usability and adaptability in rapidly changing technological environments.

EP2C70F672C8 Applications

  • Telecommunications: Utilized in communication infrastructure to enhance signal processing capabilities and data flow management, improving overall system efficiency and reliability.
  • Automotive Systems: Applied in advanced driver-assistance systems (ADAS) to process real-time sensor data and support critical functions like obstacle detection and vehicle navigation.
  • Consumer Electronics: Essential in the development of consumer electronics, such as high-performance gaming consoles and smart home devices, providing the necessary processing power and interface flexibility.
  • Industrial Automation: Drives automation solutions by managing multiple inputs and outputs in complex machinery, increasing precision and reducing operational downtime.
  • Medical Devices: Supports medical imaging systems like ultrasound and MRI, offering the processing power needed to handle large data sets and real-time imaging.
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