EP2AGX125EF29C6ES

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Mfr.Part #
EP2AGX125EF29C6ES
Manufacturer
Altera (Intel)
Package / Case
780-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 372 I/O 780FBGA
Stock
1,229
In Stock :
1,229

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Voltage - Supply :
0.87V~0.93V
Packaging :
Tray
Number of I/O :
372
Total RAM Bits :
8315904
Number of Logic Elements/Cells :
118143
Supplier Device Package :
780-FBGA (29x29)
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of LABs/CLBs :
4964
Operating Temperature :
0°C~85°C TJ
Series :
Arria II GX
Package / Case :
780-BBGA, FCBGA
Base Part Number :
EP2AGX125
Mounting Type :
Surface Mount
Datasheets
EP2AGX125EF29C6ES
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) EP2AGX125EF29C6ES from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Package / Case:780-BBGA, FCBGA, Base Part Number:EP2AGX125, Mounting Type:Surface Mount, EP2AGX125EF29C6ES pinout, EP2AGX125EF29C6ES datasheet PDF, EP2AGX125EF29C6ES amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) EP2AGX125EF29C6ES ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) EP2AGX125EF29C6ES


FPGAs Altera EP2AGX125EF29C6ES Overview

The FPGAs Altera EP2AGX125EF29C6ES by Intel represents a cutting-edge solution in programmable logic technology, expertly crafted to meet the robust needs of modern digital applications. This FPGA is designed to deliver high performance, increased functionality, and maximized I/O capabilities within a compact 780FBGA package. Catering to sophisticated electronics systems, the EP2AGX125EF29C6ES offers a flexible architecture that supports a wide range of configurations and rapid prototyping, making it an ideal choice for designers looking to push the boundaries of technological innovation.

EP2AGX125EF29C6ES Features

This particular model boasts 372 I/O pins, allowing for extensive connectivity and integration flexibility in complex systems. Its high-density integration is suitable for implementing multifunctional designs and supporting various logic configurations, which can dramatically reduce the overall system power consumption and increase the reliability of the system. The compact 780FBGA packaging not only ensures a reduced footprint but also enhances the thermal management capabilities of the device, making it robust under varied operational conditions.

EP2AGX125EF29C6ES Applications

  • Telecommunications Infrastructure: Utilized in routers, switches, and base station equipment for enhancing signal processing capabilities and data flow management.
  • Automotive Systems: Integrates into driver assistance systems and infotainment units to process multiple inputs and outputs efficiently and reliably.
  • Industrial Automation: Employs in control systems to perform complex processing tasks, ensuring high-speed operation and adaptability in various industrial environments.
  • Consumer Electronics: Used in high-performance gaming consoles and home entertainment systems, providing support for intricate graphics processing and real-time user interaction.
  • Medical Devices: Facilitates advanced functionalities in medical imaging equipment and diagnostic tools, improving the precision and response times of medical assessments.
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